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A3R1GE3FGF-G8E

Part No A3R1GE3FGF-G8E
Manufacturer Zentel
Catalog DDR
Description DDR2-800 128Mx8
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941840-A3R1GE3FGF-G8E
Series *
Ultra Librarian 3D Model Ultra Librarian A3R1GE3FGF-G8E CAD Model

Description

The A3R1GE3FGF-G8E is a DDR (Double Data Rate) memory component manufactured by Zentel. It is used in various applications requiring volatile memory for temporary data storage and fast data access.

Applications

  • Embedded Systems
  • Networking Equipment
  • Consumer Electronics (e.g., set-top boxes, TVs)
  • Industrial Control Systems
  • Automotive Infotainment Systems

Features

  • DDR SDRAM Technology
  • Capacity: 1Gb (Gigabit)
  • Operating Voltage: Typically 1.8V or 2.5V (Consult datasheet)
  • Data Rate: Varies depending on the specific DDR standard (e.g., DDR, DDR2, DDR3)
  • Package: FBGA (Fine-Pitch Ball Grid Array)

Benefits

  • High Bandwidth: DDR technology enables fast data transfer rates, improving system performance.
  • Low Power Consumption: Designed for energy-efficient operation, extending battery life in portable devices.
  • Compact Size: The FBGA package allows for high-density mounting on PCBs, saving valuable board space.
  • Reliable Data Storage: Provides reliable temporary data storage for critical system operations.
  • Cost-Effective: Offers a balance of performance and cost for various memory applications.

Additional Details

The A3R1GE3FGF-G8E's specific data rate and other detailed specifications (like timings, temperature range, and refresh rates) can only be determined by consulting the official Zentel datasheet for this part number. The datasheet will provide detailed information about the memory's organization, pinout, electrical characteristics, and recommended operating conditions. It is crucial to refer to the datasheet to ensure proper implementation and avoid damage to the component or system. Different revisions or speed grades of this part may exist, so verifying the exact datasheet for the specific marking on the chip is essential. Furthermore, proper handling procedures, especially regarding electrostatic discharge (ESD) precautions, should be followed during installation and usage of this memory component to prevent damage and ensure long-term reliability.

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