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Same model may have multiple batches, images only for reference.
XCZU4CG-L2FBVB900E Real Image
Same model may have multiple batches, images only for reference.

XCZU4CG-L2FBVB900E

Part No XCZU4CG-L2FBVB900E
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A53 900FCBGA / Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Manufacturer AMD Xilinx
Packaging Tray
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Temperature Range - Operating 0°C ~ 100°C (TJ)
Case / Package 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Number of I/O 204
Base Product Number XCZU4
RoHS Status ROHS3 Compliant
MSL Level 4 (72 Hours)
REACH Status REACH Unaffected
ECCN 5A002A4 XIL
HTSUS 8542.39.0001
Standard Package 1
Win Source Part Number 1318082-XCZU4CG-L2FBVB900E
Ultra Librarian 3D Model Ultra Librarian XCZU4CG-L2FBVB900E CAD Model

Description

The AMD Xilinx XCZU4CG-L2FBVB900E is a system on chip (SoC) manufactured by AMD Xilinx.

  • Processors: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and dual ARM®Cortex™-R5 with CoreSight™
  • Speeds: 500MHz and 1.2GHz, respectively
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Peripherals: DMA and WDT
  • I/Os: 204
  • RAM Size: 256KB
  • FPGA: Zynq®UltraScale+™ FPGA with 192K+ logic cells
  • Package: 900-FCBGA (31x31)
  • Operating Temperature: 0°C to 100°C
  • MSL Level: 4 (72 Hours)
  • HTSUS Code: 8542.39.0001

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