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XCV50-5BGG256I

Part No XCV50-5BGG256I
Manufacturer Xilinx Inc.
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description FPGA Virtex Family 57.906K Gates 1728 Cells 294MHz 0.22um (CMOS) Technology 2.5V 256-Pin BGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Mounting SMD (SMT)
Case / Package BGA
Maximum Operating Temperature 100 °C
Min Operating Temperature -40 °C
Operating Supply Voltage 2.5 V
Radiation Hardening No
RAM Size 4 kB
RoHS Compliant
Speed Grade 5
Win Source Part Number 1105803-XCV50-5BGG256I
Categories Embedded - FPGAs(Field Programmable GateArray)
Manufacturer Xilinx Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XCV50-5BGG256I CAD Model

Description

The XCV50-5BGG256I is a member of the Virtex series Field Programmable Gate Arrays (FPGAs) from Xilinx. The '50' indicates the relative logic capacity within the Virtex family, '-5' typically denotes the speed grade, 'BGG256' indicates a Ball Grid Array (BGA) package with 256 pins, and 'I' usually signifies an industrial temperature range.

Applications:

  • Industrial Control: Used in programmable logic controllers (PLCs) and other industrial automation systems.
  • Data Acquisition: Applied in data acquisition systems for sensor interfacing and data processing.
  • Embedded Systems: Employed in embedded controllers and custom hardware accelerators.
  • Networking: Utilized in network interface cards (NICs) and other networking devices.
  • Instrumentation: Used in test and measurement equipment for signal processing and control.

Features:

  • Configurable Logic Blocks (CLBs): Contains programmable CLBs for implementing custom logic functions.
  • Block RAM: Includes on-chip block RAM for data storage and buffering.
  • Input/Output Blocks (IOBs): Provides flexible IOBs for interfacing with external devices.
  • Clock Management: Features clock management circuitry for clock generation and distribution.
  • BGA Package: The 256-pin BGA package offers a high pin count in a compact form factor.

Benefits:

  • Flexibility: Allows for easy modification and customization of digital circuits.
  • Performance: Delivers high-performance operation for demanding applications.
  • Integration: Integrates multiple functions into a single device, reducing board space and complexity.
  • Industrial Temperature Range: Suitable for operation in harsh environments with a wide temperature range.
  • Cost-Effectiveness: Offers a cost-effective solution compared to custom ASICs for low to medium volume production.

Additional Details:

The XCV50-5BGG256I operates at a specified voltage level and has defined parameters for the number of logic cells, RAM size, and I/O pins, as detailed in the Xilinx datasheet. It is configured using Xilinx development tools. Refer to the official Xilinx documentation for comprehensive specifications, including power consumption, thermal characteristics, and timing details.

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