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XC7Z007S-1CLG225C Real Image XC7Z007S-1CLG225C Real Image
Same model may have multiple batches, images only for reference.
XC7Z007S-1CLG225C Real Image XC7Z007S-1CLG225C Real Image
XC7Z007S-1CLG225C Real Image XC7Z007S-1CLG225C Real Image
Same model may have multiple batches, images only for reference.

XC7Z007S-1CLG225C

Part No XC7Z007S-1CLG225C
Manufacturer Xilinx Inc.
Catalog Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 667MHZ 225BGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 51 Weeks
Features Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Artix™-7 FPGA, 23K Logic Cells 667MHz 225-CSPBGA (13x13)
Manufacturer Xilinx Inc.
Series Zynq®-7000
Package Tray
Core Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed 667MHz
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA
Number of I/O 54
Operating Temperature Range 0°C ~ 85°C (TJ)
Package 225-LFBGA, CSPBGA
Case / Package 225-CSPBGA (13x13)
Family Name XC7Z007
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Quantity per package 160
Popularity High
Supply and Demand Status Balance
Win Source Part Number 903876-XC7Z007S-1CLG225C
Ultra Librarian 3D Model Ultra Librarian XC7Z007S-1CLG225C CAD Model

Description

The XC7Z007S-1CLG225C is a high-popularity integrated circuit (IC) manufactured by Xilinx Inc.

  • Series: Zynq™-7000
  • Features: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Artix™-7 FPGA
  • Package Size: 225-LFBGA, CSPBGA
  • Operating Temperature: 0°C to 85°C (TJ)
  • I/O: 54
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG
  • Compliance: REACH

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14+ $22.6712 $317.3968
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