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Same model may have multiple batches, images only for reference.
W25Q512NWBIM Real Image
Same model may have multiple batches, images only for reference.

W25Q512NWBIM

Part No W25Q512NWBIM
Manufacturer Winbond Electronics
Catalog Memory
Description IC FLASH 512MBIT SPI 24TFBGA / FLASH - NOR Memory IC 512Mbit SPI - Quad I/O, QPI, DTR 133 MHz 6 ns 24-TFBGA (6x8)
Datasheet
W25Q512NWBIM Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs) - Memory - Memory
Mfr Winbond Electronics
Series SpiFlash®
Package Tray
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NOR
Memory Size 512Mbit
Memory Organization 64M x 8
Memory Interface SPI - Quad I/O, QPI, DTR
Clock Frequency 133 MHz
Write Cycle Time - Word, Page 3ms
Access Time 6 ns
Voltage - Supply 1.65V ~ 1.95V
Temperature Range - Operating -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 24-TBGA
Supplier Device Package 24-TFBGA (6x8)
Base Product Number W25Q512
Standard Package 480
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071
Win Source Part Number 1352239-W25Q512NWBIM
Ultra Librarian 3D Model Ultra Librarian W25Q512NWBIM CAD Model

Description

The Winbond Electronics W25Q512NWBIM is a non-volatile memory chip manufactured by Winbond Electronics.

  • Memory Size: 512Mbit
  • Clock Frequency: 133 MHz
  • Interface: SPI
  • Memory Interfaces: Quad I/O, QPI, and DTR
  • Write Cycle Time: 3ms
  • Access Time: 6ns
  • Voltage Supply Range: 1.65V to 1.95V
  • Package: 24-TBGA

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