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TH58BYG3S0HBAI6

Part No TH58BYG3S0HBAI6
Manufacturer Toshiba Semiconductor and Storage
Catalog OEM Souring
Description 8Gb NAND EEPROM
Sample
Rohs State rohs
ECAD Module
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Category OEM Souring
Win Source Part Number 1469257-TH58BYG3S0HBAI6
Manufacturer Toshiba Semiconductor and Storage
Package Tray
Product Status Active
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 8Gbit
Memory Organization 1G x 8
Write Cycle Time - Word, Page 25ns
Voltage - Supply 1.7V ~ 1.95V
Operating Temperature -40°C ~ 85°C (TA)
Grade -
Mounting Type Surface Mount
Package / Case 67-VFBGA
Supplier Device Package 67-VFBGA (6.5x8)
Ultra Librarian 3D Model Ultra Librarian TH58BYG3S0HBAI6 CAD Model

Description

The TH58BYG3S0HBAI6 is an 8Gb NAND EEPROM manufactured by Toshiba, designed for high-density, high-speed storage applications. It leverages Toshiba’s cutting-edge NAND technology to provide a reliable storage solution. This component is specifically engineered for applications requiring large non-volatile memory storage, such as solid-state drives (SSDs), digital cameras, smartphones, and other portable devices. The TH58BYG3S0HBAI6 features a high-speed read and write capability, making it an excellent choice for applications where data integrity and quick access are paramount. Its 8Gb capacity allows for substantial data storage within a compact footprint. The device supports a wide range of operating temperatures, making it versatile for use in diverse environmental conditions. Additionally, it incorporates error correction code (ECC) functionality, enhancing data reliability and integrity. The TH58BYG3S0HBAI6's low power consumption also makes it ideal for battery-powered devices, where energy efficiency is critical. Toshiba's expertise in memory technology ensures that the TH58BYG3S0HBAI6 provides a combination of high capacity, reliability, and performance for next-generation electronic devices.

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Shipping Information

Shipped from HK warehouse
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