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TE2-862-BP

Part No TE2-862-BP
Manufacturer Toshiba Semiconductor and Storage
Catalog OEM Parts (T - Z)
Description Motor Starter, solid state, open chassis, 250-700 HP, 208-575 VAC
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Win Source Part Number 998471-TE2-862-BP
Categories OEM Parts(T-Z)
Manufacturer Toshiba Semiconductor and Storage
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian TE2-862-BP CAD Model

Description

The TE2-862-BP is a Thermoelectric Cooler (TEC), also known as a Peltier cooler, manufactured by Toshiba Semiconductor and Storage. These devices are solid-state heat pumps that transfer heat from one side of the device to the other when an electrical current is applied. This creates a cold side and a hot side, allowing for precise temperature control.

Applications:

      
  • Portable refrigerators and coolers.
  •   
  • Laser diode temperature control.
  •   
  • Electronic component cooling.
  •   
  • Medical and scientific instruments.
  •   
  • CPU cooling in high-performance computers.

Features:

      
  • Solid-state construction for reliable operation.
  •   
  • Precise temperature control capabilities.
  •   
  • Compact size for space-constrained applications.
  •   
  • DC operation for easy integration with electronic circuits.
  •   
  • No moving parts, resulting in quiet and vibration-free operation.

Benefits:

      
  • Maintains precise temperature for sensitive components and applications.
  •   
  • Provides localized cooling without the need for bulky refrigeration systems.
  •   
  • Offers long-term reliability due to the absence of moving parts.
  •   
  • Enables compact and portable cooling solutions.
  •   
  • Operates quietly, making it suitable for noise-sensitive environments.

Additional Details:

The TE2-862-BP's performance characteristics, such as cooling capacity (Qmax), voltage (Vmax), current (Imax), and temperature difference (ΔTmax), depend on its specific design and materials. Proper heat sinking is crucial on the hot side to dissipate the transferred heat effectively. Without adequate heat dissipation, the cold side will not reach its minimum temperature.  The device consists of multiple p-type and n-type semiconductor elements connected electrically in series and thermally in parallel, sandwiched between two ceramic plates. By controlling the direction and magnitude of the current, the direction and amount of heat transfer can be precisely controlled. This makes it ideal for applications requiring stable and regulated temperatures.

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