The TC74HC125AP is a high-speed CMOS quad bus buffer gate fabricated with silicon gate C2MOS technology. It is designed for use in high-speed data transmission and isolation applications. The device features three-state outputs, which allow for multiple devices to share a common bus. Each buffer has an independent output enable (OE) input. When OE is low, the output is enabled, and the input signal is passed through to the output. When OE is high, the output is in a high-impedance state, effectively disconnecting the buffer from the bus.

Applications

• Bus interface
• Memory addressing
• Data multiplexing
• Isolation circuits
• Logic level translation

Features

• High-speed: tpd = 7 ns (typ.) at VCC = 5 V
• Low power dissipation: ICC = 1 μA (max) at Ta = 25°C
• Three-state outputs
• Independent output enable inputs
• High noise immunity: VNIH = VNIL = 28 % VCC (min)
• Output drive capability: 10 LSTTL loads
• Symmetrical output impedance: |IOH| = IOL = 4 mA (min)
• Balanced propagation delays: tPLH ≈ tPHL
• Wide operating voltage range: VCC = 2 V to 6 V

Benefits

• Fast switching speeds enable high-speed data transmission.
• Low power consumption makes it suitable for battery-powered and energy-efficient applications.
• Three-state outputs allow for easy bus sharing and isolation.
• Independent output enable inputs provide flexibility in circuit design.
• High noise immunity ensures reliable operation in noisy environments.
• High output drive capability can drive a large number of loads.
• Symmetrical output impedance ensures consistent signal integrity.
• Balanced propagation delays minimize timing skew, improving system performance.
• Wide operating voltage range provides flexibility in power supply selection.

Additional Details

The TC74HC125AP is supplied in a DIP14 (Dual In-Line Package) package. The operating temperature range is -40°C to 85°C. It is pin-compatible with standard TTL logic devices. Input pins are equipped with protection circuits against static discharge, protecting the device during handling and assembly. This device is often used in microprocessor-based systems to interface with memory and peripheral devices.