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2SK2615 T2LSONY,F

Part No 2SK2615 T2LSONY,F
Manufacturer Toshiba Semiconductor and Storage
Catalog Electronic Wholesale
Sample
Rohs State rohs
ECAD Module
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Reference Date Code 10Rohs
Reference case SOT89
Manufacturer Toshiba Semiconductor and Storage
Manufacturer Homepage www.semicon.toshiba.co.jp/eng
Win Source Part Number 751283-2SK2615 T2LSONY,F
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian 2SK2615 T2LSONY,F CAD Model

Description

The 2SK2615 T2LSONY,F is an N-channel silicon MOSFET from Toshiba Semiconductor and Storage. This MOSFET is designed for high-speed switching applications and power management circuits. It offers low on-resistance and fast switching speeds, making it suitable for efficient power conversion.

Applications:

  • DC-DC converters
  • Power supplies
  • Motor control circuits
  • Switching regulators
  • Load switches

Features:

  • N-Channel MOSFET
  • Low on-resistance (RDS(on)) for reduced power loss
  • Fast switching speed for high-frequency operation
  • Enhancement mode
  • Surface mount package for compact designs

Benefits:

  • Improved efficiency in power conversion circuits due to low on-resistance.
  • Reduced heat generation compared to MOSFETs with higher on-resistance.
  • Faster switching times enable operation at higher frequencies, reducing the size of passive components.
  • Simplified gate drive circuitry due to the enhancement mode operation.
  • Compact design allows for use in space-constrained applications.

Additional Details:

The 2SK2615 T2LSONY,F typically comes in a surface-mount package such as a SOT-23 or similar. Key specifications include its drain-source voltage (VDS), gate-source voltage (VGS), drain current (ID), and on-resistance (RDS(on)). The specific values for these parameters should be consulted from the official Toshiba datasheet for the part number 2SK2615. It's crucial to check the datasheet for the correct operating conditions and thermal characteristics to ensure reliable performance. Proper heat sinking may be required depending on the application and power dissipation. The MOSFET is designed for lead-free soldering processes.

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