SN74LVTH373IPWREP - Texas Instruments

The SN74LVTH373IPWREP from Texas Instruments is a high-performance, octal transparent D-type latch with 3-state outputs. This integrated circuit is designed to be used in applications that require high-speed, low-voltage operation, and improved drive capability. It is part of the LVTH family, which is characterized by low-voltage operation and the ability to drive heavily loaded outputs with very low static and dynamic power consumption.

Key Features

• 3.3-V Operation: Optimized for use in systems that require a nominal 3.3V power supply, this device supports a wide range of operating voltages.
• High Drive: With the ability to drive up to 32 mA at the outputs, the SN74LVTH373IPWREP can easily drive large loads, making it suitable for bus-oriented applications.
• Low Power Consumption: The device is designed for low power dissipation, with a typical ICC of only 0.8 mA max, minimizing the overall power consumption of the system.
• Support for Live Insertion: Features like Bus Hold on data inputs eliminate the need for external pull-up/pull-down resistors, simplifying the design and supporting live insertion and withdrawal.
• Enhanced System Reliability: The device includes over-voltage tolerance inputs that facilitate 5V tolerant I/O, ensuring compatibility with mixed-voltage systems and enhancing system reliability.
• ESD Protection: The SN74LVTH373IPWREP comes with built-in ESD protection, ensuring robustness and reliability of the device in harsh environments.

Applications

Due to its versatile nature, the SN74LVTH373IPWREP is suitable for a wide array of applications, including:

• Memory address latching
• Data storage and retrieval systems
• Buffering in high-performance systems
• Telecommunications
• Computers and peripherals

Quality and Reliability

The SN74LVTH373IPWREP is part of Texas Instruments' enhanced product (EP) portfolio, designed to meet the stringent requirements of military and high-reliability applications. It is available in a TSSOP (Thin Shrink Small Outline Package) format, which allows for a reduction in board space requirements while still providing robust performance in a wide range of environmental conditions.