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1241152-4

Name: 1241152-4
Brand: TE Connectivity
SKU: 997117
Availability: InStock
Rating: 4.84 (5 reviews)

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This model is a standard, industry-grade component frequently used in electronic manufacturing.

Part No	1241152-4
Manufacturer	TE Connectivity
Catalog	Rectangular - Board to Board Connectors
Description	CONN RCPT 4POS 0.1 GOLD SMD / 4 Position Receptacle, Bottom or Top Entry Connector 0.100" (2.54mm) Surface Mount Gold
Sample
Rohs State
ECAD Module
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Products specifications Report Issue?

Category	Connectors, Interconnects>Rectangular Connectors - Headers, Receptacles, Female Sockets
Mfr	TE Connectivity AMP Connectors
Series	AMPMODU HV-100
Package	Tape & Reel
Connector Type	Receptacle, Bottom or Top Entry
Contact Type	Female Socket
Style	Board to Board
Number of Positions	4
Number of Positions Loaded	All
Pitch - Mating	0.100" (2.54mm)
Number of Rows	1
Mounting	SMD (SMT)
Termination	Solder
Fastening Type	Push-Pull
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	31.5µin (0.80µm)
Insulation Color	Black
Insulation Height	0.244" (6.20mm)
Contact Finish - Post	Tin
Features	Pick and Place
Insulation Material	Liquid Crystal Polymer (LCP)
Contact Shape	Square
Contact Material	Copper Alloy
Contact Finish Thickness - Post	100.0µin (2.54µm)
Base Product Number	1241152
MSL Level	1 (Unlimited)
ECCN	EAR99
HTSUS	8536.69.4040
Other Names	A121787DKR,1241152-4-ND,A121787TR,A121787-ND,A121787CT,-1241152-4-SI,A121787,-1241152-4-LSI
Standard Package	700
Win Source Part Number	997117-1241152-4
Ultra Librarian 3D Model	Ultra Librarian 1241152-4 CAD Model

Description

The AMPMODU HV-100 series is a range of connectors designed for use in applications that require high voltage connections.

Connector Type: Receptacle
Entry: Bottom or Top
Fastening Type: Push-Pull
Contact Type: Female Socket
Termination: Solder
Pitch: 0.100" (2.54mm)
Packaging: Tape & Reel
Contact Finish: Gold
Contact Finish Thickness (Mating): 31.5µin (0.80µm)
Post Contact Finish: Tin
Post Contact Finish Thickness: 100.0µin (2.54µm)
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP)
Insulation Height: 0.244" (6.20mm)
Standard Package: 700
Applications: Board to Board

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