The C2012Y5V1H105Z is a multilayer ceramic capacitor (MLCC) manufactured by TDK Corporation. It belongs to the C2012 series, indicating a 2012 (0805) case size. The Y5V dielectric is characterized by its high capacitance value in a small size, but with significant capacitance variation over temperature. It is typically used for general-purpose applications where high capacitance is required and temperature stability is less critical.

Applications

• Decoupling in power circuits: Provides bulk capacitance for stabilizing voltage supply.
• Bypassing in low-frequency circuits: Filters out low-frequency noise and ripple.
• General-purpose applications: Suitable for applications where high capacitance is needed in a small size.
• Consumer electronics: Used in various electronic devices where cost-effectiveness is important.
• Energy storage: Provides localized energy storage for short-duration power demands.

Features

• Y5V Dielectric: Offers high capacitance value in a small package.
• Case Size: 2012 (0805) case size.
• Capacitance Value: 1µF.
• Voltage Rating: 50V DC.
• RoHS Compliant: Environmentally friendly and compliant with RoHS standards.

Benefits

• High Capacitance: Provides a large capacitance value in a compact size.
• Cost-Effective: Y5V dielectric offers a more economical solution compared to more stable dielectrics.
• Decoupling and Bypassing: Effective in reducing noise and stabilizing voltage supply.
• Small Size: Suitable for space-constrained applications.
• General-Purpose Use: Suitable for a wide range of applications where temperature stability is not critical.

Additional Details

The C2012Y5V1H105Z has a capacitance of 1 µF with a wide tolerance, typically +80%/-20%. Its operating temperature range is typically -30°C to +85°C. Due to the significant capacitance variation over temperature, this capacitor is best suited for applications where environmental conditions are relatively stable and precise capacitance values are not required. It is designed for reflow soldering and is suitable for automated assembly processes. Applications include general-purpose decoupling, bypass capacitors, and filtering in less critical circuits.