The C1608C0G1H821JT000N is a ceramic capacitor manufactured by TDK Corporation. It is designed for general-purpose applications, offering reliable performance in a compact size. This capacitor is part of TDK's C1608 series, indicating its EIA 0603 case size (1.6mm x 0.8mm).

Applications:

• General electronic circuits requiring capacitance.
• Bypass and decoupling applications in digital and analog circuits.
• Smoothing circuits in power supplies.
• Consumer electronics devices.
• Mobile communication devices.

Features:

• High Capacitance Value: 820pF capacitance.
• Voltage Rating: 50V voltage rating.
• Temperature Characteristics: C0G dielectric material, offering stable capacitance over a wide temperature range.
• Size: Compact 0603 case size (1.6mm x 0.8mm).
• Termination: Nickel barrier with tin plating.
• RoHS Compliant: Environmentally friendly, compliant with RoHS standards.

Benefits:

• Stable Performance: C0G dielectric ensures minimal capacitance drift with temperature and voltage changes.
• Compact Size: Suitable for high-density circuit designs.
• Reliable Operation: TDK's reputation for quality ensures long-term reliability.
• Versatile Application: Suitable for a wide range of general-purpose applications.
• Easy to Solder: Tin-plated terminations ensure easy and reliable soldering.

Additional Details:

The C1608C0G1H821JT000N utilizes a C0G (NP0) dielectric material, which provides excellent temperature stability. The capacitance changes very little over a wide temperature range, typically within ±30 ppm/°C. This makes it suitable for applications where precise and stable capacitance is required. The capacitor has a tolerance of ±5%. The operating temperature range is typically -55°C to +125°C. It's commonly used in circuits where stable performance under varying environmental conditions is crucial. The termination is typically a nickel barrier with tin plating, providing good solderability and preventing leaching of the termination during soldering. Packaging typically involves tape and reel for automated assembly processes.