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S71WS256PC0HH3SR0

Part No S71WS256PC0HH3SR0
Manufacturer Spansion
Catalog Hard To Find
Sample
Rohs State rohs
ECAD Module
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Reference Date Code 07+
Reference case PB-FREE
Manufacturer Spansion
Manufacturer Homepage www.spansion.com
Win Source Part Number 716073-S71WS256PC0HH3SR0
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian S71WS256PC0HH3SR0 CAD Model

Description

The S71WS256PC0HH3SR0 is a 256Mbit HyperFlash™ NOR Flash memory device manufactured by Spansion (now Cypress Semiconductor, and subsequently Infineon Technologies). This high-performance memory is designed for applications requiring fast read access times, low power consumption, and a compact form factor. It utilizes a HyperBus™ interface for high bandwidth communication.

Applications:

  • Automotive Infotainment Systems
  • Industrial Control Systems
  • Networking Equipment
  • Embedded Systems with High-Performance Requirements
  • Consumer Electronics (e.g., Tablets, Gaming Consoles)

Features:

  • 256Mbit Density
  • HyperFlash™ Technology
  • HyperBus™ Interface
  • Fast Read Access Times
  • Low Power Consumption
  • Compact Package
  • Volatile Latency Mode (VLM)
  • Extended Temperature Range

Benefits:

  • High Performance: Fast read access times enable quick boot times and efficient data retrieval.
  • Low Power: Minimizes energy consumption, extending battery life in portable devices.
  • Compact Size: Allows for integration in space-constrained applications.
  • High Bandwidth: HyperBus interface provides high data transfer rates.
  • Reliable Data Storage: NOR Flash technology ensures data retention and endurance.
  • Wide Operating Temperature: Suitable for use in harsh environments.

Additional Details:

The S71WS256PC0HH3SR0 operates at a voltage range of typically 1.8V or 3.0V. The HyperBus interface significantly reduces the number of pins required compared to traditional parallel NOR Flash memories. This allows for smaller and simpler board designs. The device supports Volatile Latency Mode (VLM), which provides deterministic read latency. The operating temperature range extends from -40°C to +85°C. This Flash memory is often used to store boot code, application code, and data in embedded systems. The device supports various security features, including protection against unauthorized access. It is packaged in a BGA (Ball Grid Array) package. The specific package code (HH3SR0) refers to the package type and dimensions. The device is designed for high-reliability applications and undergoes rigorous testing to ensure quality and performance.

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Shipping Information

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