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S71PL127JB0BAW9U

Part No S71PL127JB0BAW9U
Manufacturer Spansion
Catalog Unclassified Memory
Sample
Rohs State rohs
ECAD Module
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Manufacturer Spansion
Category Integrated Circuits(ICs)
Family Memory
Win Source Part Number 186492-S71PL127JB0BAW9U
Popularity Low
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian S71PL127JB0BAW9U CAD Model

Description

The S71PL127JB0BAW9U is a 128 Mbit (134,217,728 bits) Parallel Flash memory device from Spansion. Part of the Spansion Parallel Flash memory series, it's engineered for reliable and high-performance data storage in embedded systems. Its specific voltage requirements and temperature resilience make it versatile across diverse applications.

Applications

  • Embedded systems requiring non-volatile memory
  • Automotive electronics (e.g., navigation systems, engine control units)
  • Industrial automation equipment
  • Networking devices (e.g., routers, switches)
  • Consumer electronics (e.g., digital cameras, portable media players)

Features

  • 128 Mbit (134,217,728 bits) storage capacity
  • Parallel interface for rapid data transfer
  • Sector Erase capabilities
  • Page Program features
  • Supports varied operating voltages (consult datasheet for specifics)
  • Low-power modes for energy efficiency
  • Wide operating temperature range for industrial use
  • Data protection features to ensure memory integrity

Benefits

  • High Speed: Parallel interface enables fast read and write times for efficient system performance.
  • Reliable Storage: Spansion Flash memory ensures long-term data retention and high endurance.
  • Low Power: Optimized power consumption extends battery life in portable applications and reduces overall system power needs.
  • Durable: Designed to withstand demanding environments common in automotive and industrial sectors.
  • Secure: Security features protect stored data from unauthorized access and corruption.

Additional Details

The S71PL127JB0BAW9U employs a sector erase architecture, enabling efficient memory management. This device is typically packaged for surface mount assembly, often in TSOP or BGA formats, facilitating seamless integration into circuit boards. The device datasheet contains comprehensive specifications, including operating voltage, timing details, and package dimensions. The datasheet also includes details about program and erase cycles, data retention specifications, and detailed information regarding any security features.

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