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S29AL016D90TFI013

Part No S29AL016D90TFI013
Manufacturer Spansion
Catalog Flash
Description 16 MEGABIT CMOS 3.0 VOLT ONLY BOOT SECTOR FLASH MEMORY
Sample
Rohs State rohs
ECAD Module
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Manufacturer Spansion
Category Integrated Circuits(ICs)
Family Memory
Win Source Part Number 185935-S29AL016D90TFI013
Popularity Medium
Supply and Demand Status Limited
Ultra Librarian 3D Model Ultra Librarian S29AL016D90TFI013 CAD Model

Description

The S29AL016D90TFI013 is a 16-Megabit (2 M x 8-bit or 1 M x 16-bit) CMOS 3.0 Volt-only, simultaneous Read/Write Flash memory device. It is manufactured by Spansion and offers high performance and reliability for embedded systems.

Applications

  • Embedded systems for code storage
  • Data storage in portable devices
  • Boot memory in networking equipment
  • Firmware storage in consumer electronics
  • Industrial control systems

Features

  • 3.0 Volt-only operation for read and write
  • Simultaneous Read/Write operation
  • Sector erase architecture
  • Top or bottom boot block configurations available
  • Fast program and erase times
  • Low power consumption
  • Offers protection features such as sector protection and password protection
  • Available in different package options for design flexibility
  • Compliant with industry standards for Flash memory devices

Benefits

  • Enables fast and reliable storage and retrieval of code and data
  • Simplifies system design with single voltage operation
  • Reduces power consumption, extending battery life in portable applications
  • Provides flexibility in memory organization with sector erase architecture
  • Protects critical code and data with security features
  • Offers a wide range of operating temperatures for use in various environments
  • Allows for quick and efficient updates with fast programming and erase times

Additional Details

The S29AL016D90TFI013 operates at 90 ns access time. It supports common flash interface (CFI) for easy integration into existing systems. The device utilizes advanced process technology to deliver high performance and reliability. It is designed for applications requiring high-density, high-performance non-volatile memory.

Package type is typically TSOP (Thin Small Outline Package) or BGA (Ball Grid Array), making it suitable for surface mount assembly. The exact package details depend on the specific ordering options.

The device's simultaneous Read/Write capability is crucial for systems that require continuous operation even during programming or erasing. This feature minimizes downtime and ensures system responsiveness.

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