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SST38VF6404B-70-4C-EKE

Part No SST38VF6404B-70-4C-EKE
Manufacturer Silicon Storage Technology, Inc
Catalog Misc Products
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Categories Uncategorized
Manufacturer Silicon Storage Technology, Inc
Popularity Low
Supply and Demand Status Balance
Win Source Part Number 838873-SST38VF6404B-70-4C-EKE
Ultra Librarian 3D Model Ultra Librarian SST38VF6404B-70-4C-EKE CAD Model

Description

The SST38VF6404B-70-4C-EKE is a 64 Mbit Multi-Purpose Flash (MPF) memory device from Silicon Storage Technology (SST). It is designed for applications demanding high-density non-volatile storage, fast access times, and low power operation. This device utilizes SST's SuperFlash technology, offering excellent endurance and reliability.

Applications

  • Code storage in embedded systems
  • Data storage in portable devices
  • Firmware storage in networking equipment
  • Graphics data storage in displays
  • Storage of user data in consumer electronics

Features

  • 64 Mbit (8 Mbyte) memory capacity
  • Fast read access time of 70 ns
  • Low power consumption, suitable for battery-powered devices
  • High endurance: 100,000 erase/write cycles (typical)
  • Uniform block and sector erase architecture
  • Single 2.7-3.6V power supply
  • JEDEC standard interface
  • Embedded Erase and Program Algorithms

Benefits

  • Enables fast system boot-up and efficient application performance.
  • Reduces power consumption, extending battery life in portable applications.
  • Simplifies system integration with a standard interface.
  • Ensures data retention for long periods.
  • Provides flexibility with uniform block and sector erase options.
  • Faster programming times due to embedded algorithms.

Technical Specifications

The SST38VF6404B-70-4C-EKE has a read access time of 70 ns. It operates on a single 2.7-3.6V power supply. The endurance rating is 100,000 erase/write cycles. The device has a uniform block and sector erase architecture, simplifying memory management. Data retention is guaranteed for at least 20 years. It is available in a standard package, such as TSOP or BGA. Detailed specifications, including timing diagrams and power consumption figures, are available in the SST datasheet. The package options include surface-mount packages for automated assembly.

This MPF device is well-suited for applications requiring high-density non-volatile storage with fast access and low power. Its high endurance and flexible erase architecture make it a reliable and versatile choice for a wide range of embedded systems and consumer electronics.

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