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WFY3P02

Part No WFY3P02
Manufacturer Shenzhen Winsemi Microelectronics Co., Ltd
Catalog Electronic Wholesale
Description TrenchPowerMOSFET −20 V,Single P−Channel, SOT−23
Sample
Rohs State rohs
ECAD Module
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Manufacturer Shenzhen Winsemi Microelectronics Co., Ltd
Win Source Part Number 1280350-WFY3P02
Manufacturer Homepage www.winsemi.com
Popularity Medium
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian WFY3P02 CAD Model

Description

The WFY3P02 is a P-channel enhancement mode MOSFET manufactured by Shenzhen Winsemi Microelectronics Co., Ltd. It is designed for various power management applications requiring a P-channel device, often used in load switching, high-side switching, and battery management systems.

Applications:

  • Load Switching
  • High-Side Switching
  • Battery Management Systems
  • Power Management in Portable Devices
  • DC-DC Converters

Features:

  • P-Channel Enhancement Mode
  • Low Gate Threshold Voltage
  • Low On-Resistance (RDS(on))
  • Fast Switching Speed
  • Surface Mount Package
  • RoHS Compliant

Benefits:

  • Efficient power management due to low RDS(on)
  • Simplified gate drive requirements
  • Reduced power loss
  • Compact design for portable applications
  • Improved system reliability

Additional Details:

The WFY3P02 is typically available in a small surface-mount package, such as SOT-23 or similar. Key specifications include a drain-source voltage (VDS), a continuous drain current (ID), and a gate-source voltage (VGS). The RDS(on) value is a critical parameter and will be specified at a given VGS and ID. This MOSFET is designed for low gate threshold voltage, which simplifies the drive requirements and allows for use in low-voltage applications. Datasheets are important to review for specific operating characteristics.

Because it's a P-channel device, it's activated by a negative voltage on the gate relative to the source. This simplifies high-side switching applications, where a simpler low-side driver can be used. Thermal considerations are still important, though often less critical in low-power applications. Proper PCB layout and thermal vias can help to dissipate heat and maintain the device within its safe operating temperature range. The device is designed for robust operation, but external protection may be added.

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