The ZW-35-11-T-S-463-187-LL is a Samtec Z-Wedge™ board-to-board connector. It is designed for high-density, high-speed applications. The connector provides a reliable and robust connection between two printed circuit boards. The Z-Wedge™ contact system ensures excellent signal integrity and mechanical stability.

Applications

• Board-to-board connections in high-speed systems
• Datacom equipment
• Telecom equipment
• Industrial automation
• Medical devices

Features

• High-density design
• High-speed performance
• Z-Wedge™ contact system
• Surface mount termination
• 35 positions
• Mates with ZW-35 series connectors

Benefits

• Enables high-density board stacking.
• Supports high-speed data transmission.
• Provides a reliable and robust connection.
• Simplifies assembly with surface mount technology.
• Offers a wide range of mating heights.

Additional Details

The ZW-35-11-T-S-463-187-LL features a 35-position single row configuration. The "T" in the part number indicates tin plating, and "S" signifies a single row. The "463" refers to the stack height, and "187" indicates the post height. The "LL" designates lead-free construction. The connector is designed for reflow soldering and meets RoHS compliance. The Z-Wedge™ contact system utilizes a stamped and formed contact that provides multiple points of contact for enhanced reliability. The connector's design minimizes impedance discontinuities, ensuring excellent signal integrity at high frequencies.

Samtec offers various mating connectors and tooling to support the ZW-35 series. Consult the Samtec website or catalog for detailed specifications, 3D models, and application notes.