The SSQ-130-04-F-D is a Tiger Beam™ socket strip manufactured by Samtec. It's designed for high-density, board-to-board interconnections, where reliability and signal integrity are paramount. This particular component is a double-row, 30-position socket strip with a 0.635mm pitch and features a standard contact force.

Applications

• High-Density Board-to-Board Connections: Used in applications requiring a large number of signals to be transmitted between boards in a compact space.
• Networking Equipment: Employed in switches, routers, and other networking devices for interconnecting various modules.
• Telecommunications Systems: Utilized in telecom infrastructure for reliable connections in densely packed systems.
• Industrial Control Systems: Suitable for use in industrial automation and control equipment where robust and reliable connections are necessary.
• Medical Devices: Applied in medical equipment where signal integrity and reliability are critical for accurate data transmission and operation.

Features

• 0.635mm Pitch: Provides a high-density interconnect solution, maximizing board space utilization.
• Double Row: Offers a greater number of contacts in a smaller footprint compared to single-row connectors.
• 30 Positions: Accommodates a specific number of signal connections based on application requirements.
• Tiger Beam™ Contacts: Samtec's Tiger Beam™ contact system ensures a reliable and secure connection with high withdrawal forces.
• Standard Contact Force: Provides a balance between insertion/withdrawal force and contact reliability.
• Surface Mount Technology (SMT): Designed for easy and efficient surface mount soldering onto the PCB.

Benefits

• Increased Board Density: The fine pitch and double-row design allow for a higher density of connections in a smaller area, optimizing board space.
• Reliable Signal Transmission: The Tiger Beam™ contact system ensures a stable and secure connection, minimizing signal loss and maintaining signal integrity.
• Simplified Assembly: Surface mount design simplifies the assembly process and reduces manufacturing costs.
• Versatile Applications: Suitable for a wide range of applications requiring high-density interconnects.
• Durable Construction: Constructed with high-quality materials to ensure long-term reliability.

Additional Details

The SSQ-130-04-F-D typically features a black insulator material. The contact material is usually a beryllium copper alloy with gold or tin plating, depending on the specific variant. It's designed for reflow soldering processes. Current rating, voltage rating, and operating temperature ranges depend on the specific application and should be verified in the datasheet.