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SMS-106-02-G-S

Part No SMS-106-02-G-S
Manufacturer Samtec Inc.
Catalog Rectangular Connectors
Description CONN RCPT 6POS 0.05 GOLD PCB / 6 Position Receptacle Connector 0.050" (1.27mm) Through Hole Gold
Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Connectors, Interconnects>Rectangular Connectors - Headers, Receptacles, Female Sockets
Mfr Samtec Inc.
Series SMS
Package Bulk
Connector Type Receptacle
Contact Type Forked
Style Board to Board
Number of Positions 6
Number of Positions Loaded All
Pitch - Mating 0.050" (1.27mm)
Number of Rows 1
Mounting Type Through Hole
Termination Solder
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Insulation Color Black
Insulation Height 0.335" (8.51mm)
Contact Length - Post 0.190" (4.83mm)
Temperature Range - Operating -55°C ~ 125°C
Contact Finish - Post Gold
Current Rating (Amps) 5A per Contact
Insulation Material Liquid Crystal Polymer (LCP)
Contact Shape Square
Contact Material Phosphor Bronze
Contact Finish Thickness - Post 3.00µin (0.076µm)
Base Product Number SMS-106
MSL Level 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040
Other Names SAM9966
Standard Package 1
Win Source Part Number 1094581-SMS-106-02-G-S
Ultra Librarian 3D Model Ultra Librarian SMS-106-02-G-S CAD Model

Description

The SMS series from Samtec Inc. is a board to board style rectangular connector with a pitch of 0.050" (1.27mm) and a receptacle connector type.

  • Positions: 6 forked contact positions loaded
  • Contact Material: Phosphor bronze
  • Contact Plating (Mating): Gold with a thickness of 10.0µin (0.25µm)
  • Contact Plating (Post): Gold with a thickness of 3.00µin (0.076µm)
  • Fastening Type: Push-pull
  • Termination: Solder terminated
  • Insulation Material: Liquid crystal polymer (LCP)
  • Insulation Height: 0.335" (8.51mm)
  • Temperature Range: -55°C to 125°C
  • Mounting: Through-hole mounting
  • Color: Black
  • Package: Bulk
  • Ideal for: Applications that require a high-density and high-reliability connection

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