The SFSD-30-28-G-27.56-D-NDX is a high-density socket from Samtec's SFSD series, designed for board-to-board connections. It features a 0.050" (1.27 mm) pitch and 30 total positions arranged in a double-row configuration (likely 2x15). The 'G' indicates gold plating on the contacts for superior conductivity and corrosion resistance. The '27.56' specifies the stack height in millimeters, measured from the board surface to the top of the connector. The 'D' indicates double the standard number of rows for increased density, and the 'NDX' typically denotes a customer-specific or non-standard option, often related to packaging or manufacturing processes.

Applications

• High-density board-to-board connections in electronic devices.
• Data and signal transmission in compact systems.
• Medical devices.
• Industrial control systems.
• Telecommunications equipment.

Features

• 0.050" (1.27 mm) pitch allows for high-density interconnects.
• 30 positions in a double-row configuration.
• Gold-plated contacts for excellent electrical performance and durability.
• Through-hole termination for a robust mechanical connection to the PCB.

Benefits

• Enables compact and space-saving designs in electronic assemblies.
• Provides reliable signal transmission with gold-plated contacts.
• Ensures long-term performance and reliability in harsh environments.
• Offers a secure and stable connection to the PCB.

Additional Details

The SFSD series is known for its robust construction and high-performance capabilities. The gold plating ensures low contact resistance and excellent resistance to corrosion, making it suitable for demanding applications. The 'NDX' designator likely specifies a unique customer requirement or internal Samtec specification, often related to packaging or special testing. The 'D' code suggests some variation from the typical double row setup. Mating connectors would typically be a terminal strip from the same series or a compatible series with the same pitch and number of positions.