The HDWM-08-61-L-D-803 is a high-density, surface-mount socket strip manufactured by Samtec. It's part of the HDWM series, designed for board-to-board connections in high-speed and high-density applications. This connector provides a reliable and space-saving solution for connecting two PCBs.

Applications

• Board-to-board connections in high-density electronic devices
• Medical equipment
• Industrial automation systems
• Telecommunications equipment
• Data networking equipment
• Test and measurement instruments

Features

• High-density design: Allows for a large number of connections in a small footprint.
• Surface-mount termination: Enables automated assembly and reduces manufacturing costs.
• 0.050" (1.27 mm) pitch: Provides a fine pitch for high-density interconnects.
• Dual-row configuration: Increases the number of contacts in a given area.
• Gold-plated contacts: Ensures reliable electrical performance and corrosion resistance.
• RoHS compliant: Meets environmental regulations.
• 8 positions per row: Total of 16 contacts.

Benefits

• Space savings: Maximizes board space utilization.
• Reliable connection: Provides a secure and stable electrical connection.
• High-speed performance: Suitable for high-frequency signals.
• Easy assembly: Simplifies the manufacturing process.
• Long-term reliability: Designed for extended service life.
• Cost-effective solution: Offers a balance of performance and affordability.

Additional Details

The HDWM-08-61-L-D-803 features a black liquid crystal polymer (LCP) insulator. The contact material is beryllium copper. The current rating is typically around 1 amp per contact. The operating temperature range is typically from -55°C to +125°C. Mating connectors include Samtec's HDMM series header strips. The "-L" in the part number signifies a standard tail length, and the "-D" indicates a dual-row configuration. The "-803" at the end of the part number is likely a Samtec internal code, possibly related to plating or packaging.