The FLE-113-01-G-DV-A-P, manufactured by Samtec, is a state-of-the-art Board to Board & Mezzanine Connector, engineered to cater to the demanding requirements of modern electronic devices. This component is pivotal in enabling interconnectivity between different circuit boards within an electronic assembly, facilitating both vertical and horizontal stacking options. With a dual-row configuration and a 2mm pitch, it offers a compact solution without compromising on the integrity of electrical connections. Designed to be versatile, it supports through-hole mounting technology, making it highly adaptable to various PCB designs. Its gold-plated contacts ensure superior conductivity and resistance to corrosion, thereby enhancing the overall performance and longevity of the connection. Primarily used in applications that demand high-density interconnections with reliable performance, such as computing, telecommunications, and industrial controls, the FLE-113-01-G-DV-A-P stands out for its durability, design flexibility, and electrical reliability, making it a preferred choice among professionals seeking quality and sustainability.