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K4S280832I-TC75

Part No K4S280832I-TC75
Manufacturer Samsung
Catalog Hard To Find
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Reference Date Code 0746+
Reference case TSOP-54
Manufacturer Samsung
Manufacturer Homepage www.samsung.com/Products/Semiconductor
Win Source Part Number 714663-K4S280832I-TC75
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian K4S280832I-TC75 CAD Model

Description

The Samsung K4S280832I-TC75 is a 128Mb (4M x 32bit x 4 Banks) Synchronous DRAM, often used in applications requiring high-speed data access and moderate memory capacity. This SDRAM chip is designed to operate at PC133 speeds, making it suitable for a range of computing and embedded systems.

Applications:

  • Graphics cards: Used as frame buffers in low to mid-range graphics solutions.
  • Set-top boxes: Provides memory for processing and displaying multimedia content.
  • Networking equipment: Employed in routers and switches for packet buffering and data storage.
  • Embedded systems: Integrated into various embedded systems requiring external memory.

Features:

  • PC133 operation: Supports a maximum clock frequency of 133 MHz.
  • 4 Banks: Internal bank architecture enables concurrent memory accesses.
  • LVTTL compatible inputs: Ensures compatibility with a wide range of logic devices.
  • Self Refresh Capability: Allows the device to retain data while consuming minimal power.
  • Programmable Burst Length: Supports burst lengths of 1, 2, 4, 8, and full page.
  • Programmable CAS Latency: Supports CAS latencies of 2 and 3.

Benefits:

  • High Bandwidth: Enables fast data transfer rates, improving system performance.
  • Low Power Consumption: Self-refresh mode reduces power consumption in standby mode.
  • Cost-Effective: Provides a balance between performance and cost for various applications.
  • Wide Availability: Commonly available, simplifying procurement and maintenance.
  • Industry Standard: Complies with industry-standard SDRAM specifications, ensuring compatibility.

Additional Details:

The K4S280832I-TC75 operates within a voltage range of 3.3V ± 0.3V. It's packaged in a TSOP (Thin Small Outline Package), which facilitates surface mounting on PCBs. The device supports various power-saving modes to minimize energy consumption when not actively performing read or write operations. The -TC75 indicates a specific temperature grade and speed bin for this particular SDRAM chip, which should be considered when selecting it for an application to ensure proper operation within the operating environment.

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