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QCA-6174A-5-172BWLNSP

Part No QCA-6174A-5-172BWLNSP
Manufacturer Qualcomm
Catalog OEM Souring
Description WLAN+ BTCombo Module Chip
Sample
Rohs State Need to verify
ECAD Module
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Category OEM Souring
Win Source Part Number 1467699-QCA-6174A-5-172BWLNSP
Manufacturer Qualcomm
Ultra Librarian 3D Model Ultra Librarian QCA-6174A-5-172BWLNSP CAD Model

Description

The QCA-6174A-5-172BWLNSP by Qualcomm is a sophisticated WLAN + BT Combo Module Chip designed to provide superior wireless connectivity solutions. This component is part of Qualcomm's innovative portfolio, focused on wireless communication technologies. It offers dual-band Wi-Fi and Bluetooth connectivity, enabling devices to connect to high-speed internet and communicate with other Bluetooth-enabled devices seamlessly. This chip is specifically engineered for use in a wide range of applications, including consumer electronics, automotive systems, and industrial devices, where reliable wireless connectivity is paramount. The integration of Wi-Fi and Bluetooth functions into a single module not only conserves space but also reduces power consumption, making it an excellent choice for portable and battery-powered devices. Its advanced features support high data throughput and low latency connectivity, essential for streaming multimedia content, online gaming, and IoT applications. Qualcomm's expertise in wireless technology is evident in this robust, efficient, and versatile communication module, designed to meet the evolving demands of modern wireless communication networks.

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