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PI74FCT273TSC

Part No PI74FCT273TSC
Manufacturer Pericom
Catalog OEM Parts (O - R)
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1084838-PI74FCT273TSC
Categories OEM Parts(O-R)
Manufacturer Pericom
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian PI74FCT273TSC CAD Model

Description

The PI74FCT273TSC is a high-speed, low-power octal D-type flip-flop from Pericom Semiconductor. This device is designed for use in high-performance memory and register applications, utilizing advanced CMOS technology to achieve superior speed and minimal power consumption. It's part of the FCT (Fast CMOS Technology) family, known for its ability to provide TTL-compatible input and output levels while operating at significantly higher speeds compared to traditional TTL logic.

Applications

  • High-speed memory buffers
  • Address and data registers
  • Clocked storage elements in digital systems
  • Pipeline registers
  • Microprocessor-based systems

Features

  • High-speed operation: tpd = 4.5 ns (typical)
  • Low power consumption: ICC = 8 mA (typical)
  • TTL-compatible input and output levels
  • Output drive capability: 48 mA
  • Positive-edge triggered D-type flip-flops
  • Direct clear input
  • Available in SOIC and TSSOP packages

Benefits

  • Increased system performance due to fast propagation delay.
  • Reduced power consumption, leading to energy efficiency.
  • Easy integration with TTL logic devices.
  • High output drive capability enables direct driving of bus lines.
  • Simplified system design with positive-edge triggering and direct clear.
  • Compact size for space-constrained applications.

The PI74FCT273TSC features eight D-type flip-flops with a common clock and clear input. Each flip-flop stores the logic level present at its data (D) input on the positive-going transition of the clock (CLK) input. A low level on the clear (CLR) input resets all flip-flops independently of the clock. The device operates from a single 5V power supply and is available in surface-mount packages for efficient board assembly. This makes it suitable for modern, high-density circuit board designs. The device's robust design ensures reliable operation over a wide range of temperature and voltage conditions.

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