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SPC5603BF2MLH6

Part No SPC5603BF2MLH6
Manufacturer NXP / Nexperia
Catalog Embedded - Microcontrollers
Datasheet
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs)>Embedded - Microcontrollers
Mfr NXP USA Inc.
Series MPC56xx Qorivva
Package Tray
Core Processor e200z0h
Core Size 32-Bit Single-Core
Speed 64MHz
Connectivity CANbus, I2C, LINbus, SCI, SPI
Peripherals DMA, POR, PWM, WDT
Number of I/O 45
Program Memory Size 384KB (384K x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 28K x 8
Supply Voltage - Operating 3V ~ 5.5V
Data Converters A/D 12x10b
Oscillator Type Internal
Temperature Range - Operating -40°C ~ 125°C (TA)
Mounting SMD (SMT)
Package / Case 64-LQFP
Supplier Device Package 64-LQFP (10x10)
Base Product Number SPC5603
Other Names 935314733557
Standard Package 800
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Win Source Part Number 1263952-SPC5603BF2MLH6
Ultra Librarian 3D Model Ultra Librarian SPC5603BF2MLH6 CAD Model

Description

Product Overview

The SPC5603BF2MLH6 is a cutting-edge microcontroller unit (MCU) from NXP's popular SPC5 family, designed to cater to the demanding needs of automotive and industrial applications. This MCU is built on Power Architecture® technology, renowned for its high-performance processing capabilities and efficiency.

Key Features

  • Core: The SPC5603BF2MLH6 is equipped with a 32-bit Power Architecture e200z0h CPU core, operating at speeds up to 64 MHz, which provides a perfect balance between computational power and energy consumption.
  • Memory: It boasts an ample memory configuration with 512 KB of flash memory for program storage and 64 KB of RAM for efficient data handling and processing.
  • Advanced Timer: The MCU includes a Modular I/O System (MIOS) that supports complex timing and PWM generation, making it ideal for precise control tasks.
  • Communication Interfaces: A variety of communication interfaces such as CAN, LIN, and serial communication interfaces (SCI) are integrated to ensure versatile connectivity options.
  • Analog-to-Digital Converters (ADC): It features multiple 10-bit ADCs with fast conversion times, enabling accurate sensor data acquisition.
  • Package: The device comes in a low-profile 64-pin LQFP package, which is suitable for space-constrained applications.
  • Temperature Range: With an operational temperature range of -40°C to +125°C, the SPC5603BF2MLH6 is designed to withstand harsh environments.

Applications

The robust feature set of the SPC5603BF2MLH6 makes it an ideal choice for a wide range of applications, particularly in the automotive sector, including engine management, transmission control, body control modules, and advanced driver-assistance systems (ADAS). Its reliability and adaptability also make it suitable for industrial control systems and smart sensors.

Quality and Reliability

NXP is committed to delivering high-quality products, and the SPC5603BF2MLH6 is no exception. It is manufactured to meet the stringent requirements of the automotive industry, ensuring reliability and performance in critical applications. Developers can rely on this MCU to build systems that not only meet but exceed the expectations for modern automotive and industrial electronic systems.

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