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MC9S08QA4CPAE

Part No MC9S08QA4CPAE
Manufacturer NXP / Nexperia
Catalog Embedded - Microcontrollers
Description 8-bit HCS08 Central Processor Unit (CPU) | IC MCU 8BIT 4KB FLASH 8DIP
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits
Manufacturer NXP
Packaging Tube
Core Processor S08
Data Bus Width 8-Bit
Speed 20MHz
Peripherals LVD, POR, PWM, WDT
The number of I/O 4
Program Memory Size 4KB (4K x 8)
Program Memory Type FLASH
Date RAM Size 256 x 8
Supply Voltage 1.8V ~ 3.6V
Data Converters A/D 4x10b
Temperature Range - Operating -40°C ~ 85°C
Mounting Style Through Hole
Manufacturer Package 8-DIP
Supplier Device Package 8-PDIP
Family Part Number MC9S08QA4
Manufacturer Pack Quantity 50
MSL Level Not Applicable
Win Source Part Number 1220483-MC9S08QA4CPAE
Manufacturer Homepage www.freescale.com
Popularity Medium
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian MC9S08QA4CPAE CAD Model

Description

MC9S08QA4CPAE from NXP / Nexperia is an embedded microcontroller used in compact control, sensing, and interface designs where reliable low-complexity processing is needed. Devices in this class are commonly considered for consumer electronics, industrial controls, small appliances, instrumentation, and general embedded systems that require deterministic operation and straightforward firmware development. For engineering teams maintaining legacy platforms or evaluating compatible microcontroller options, this part may be relevant in cost-sensitive and space-constrained designs. Because the exact lifecycle status provided here is unknown, buyers and design engineers should confirm current production standing, package availability, and long-term supply directly with the manufacturer or an authorized distributor before committing to new designs. RoHS compliance information is also not available in the provided data, so environmental compliance should be verified through official datasheets, material declarations, or manufacturer-issued compliance statements. This approach helps reduce redesign risk and supports better sourcing decisions.

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