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74LVT16245BDGG

Part No 74LVT16245BDGG
Manufacturer NXP / Nexperia
Catalog Hard To Find
Description Bus XCVR Dual 16-CH 3-ST 48-Pin TSSOP / 3.3V ABT 16-bit transceiver 3-State
Sample
Rohs State rohs
ECAD Module
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Manufacturer NXP
Win Source Part Number 1133154-74LVT16245BDGG
Manufacturer Homepage www.nxp.com
Is this a common-used part? Yes
Popularity High
Supply and Demand Status Balance
Family Name 74LVT16245
Introduction Date April 15, 2005
ECCN EAR99
Country of Origin China, Philippines, Thailand
Halogen Free Compliant
Estimated EOL Date 2027
Ultra Librarian 3D Model Ultra Librarian 74LVT16245BDGG CAD Model

Description

The NXP 74LVT16245BDGG is a high-performance, low-voltage BiCMOS device that is part of the LVT family, which stands for Low Voltage Technology. This integrated circuit is designed to address the needs for high-speed data transfer and signal integrity in a wide array of digital applications. It is particularly suitable for interfacing with 3.3V and 5V systems, making it a versatile choice for mixed-voltage environments.

Key Features

  • Bi-directional Interface: This device features a 16-bit transceiver with bi-directional data flow, which allows for flexible data exchange between buses.
  • Low Voltage Operation: It operates at a nominal voltage of 3.3V, which can help reduce power consumption and is compatible with 5V tolerant inputs.
  • High-Speed Performance: Capable of supporting data transfer speeds that are consistent with the high demands of modern digital systems.
  • Bus-Hold Data Inputs: The inputs include a bus-hold feature, which eliminates the need for external pull-up or pull-down resistors and ensures a stable state when inputs are left floating.
  • Output Disable Feature: Outputs can be placed in a high-impedance state, which is essential for shared data lines and preventing bus contention.
  • Live Insertion and Extraction: Designed to support live insertion and extraction without causing glitches or disruptions on the bus lines.

Applications

The 74LVT16245BDGG is ideal for use in a diverse range of applications, including telecommunications, computing, and industrial systems where reliable and fast data transfer is critical. Its ability to interface seamlessly between different voltage domains also makes it a popular choice for system upgrades and mixed-voltage system designs.

Package Information

The device is offered in a 48-pin TSSOP (Thin Shrink Small Outline Package) type, denoted by the 'BDGG' suffix in the part number. This package is optimized for reduced space on PCBs and enhanced thermal performance, ensuring reliable operation even in space-constrained applications.

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Pricing & Ordering

Quantity Unit Price Ext. Price
75+ $0.7785 $58.3875
160+ $0.7288 $116.6080
250+ $0.7034 $175.8500
355+ $0.6537 $232.0635
460+ $0.6283 $289.0180
575+ $0.6029 $346.6675
!
Prices are subject to market and will be confirmed after the order is placed.
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 2,634 pieces
MOQ: 65 pcs
Order Increment : 1 pcs
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