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74LVCH16823DGG

Part No 74LVCH16823DGG
Manufacturer NXP / Nexperia
Catalog Logic - Buffers, Drivers, Receivers, Transceivers
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits(ICs)
Family Logic - Buffers,Drivers,Receivers,Transceivers
Manufacturer NXP
Win Source Part Number 165538-74LVCH16823DGG
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian 74LVCH16823DGG CAD Model

Description

Product Overview: 74LVCH16823DGG from NXP

The 74LVCH16823DGG is a high-performance, low-voltage 18-bit universal bus driver with 3-state outputs, designed by NXP Semiconductors. This integrated circuit is part of the LVCH family and is optimized for use in demanding applications where signal integrity and high-speed data transmission are critical. It is particularly well-suited for interfacing with memory modules, including RAM, ROM, and flash memory, as well as for general-purpose bus interface applications in computing and telecommunication systems.

Key Features

  • Wide Operating Voltage Range: The device is designed to operate with a 2.3V to 3.6V power supply, making it compatible with low-voltage systems and ensuring reduced power consumption.
  • High Drive Capability: With its 18-bit bus interface, the 74LVCH16823DGG can drive heavily loaded bus lines with up to 24 mA on both the high and low sides, providing robust signal integrity.
  • Bus-Hold Data Inputs: The bus-hold feature eliminates the need for external pull-up or pull-down resistors by maintaining the last driven state, thereby simplifying board design and reducing component count.
  • 3-State Outputs: The 3-state outputs enable connection to a common bus, which can be effectively isolated by placing the outputs in a high-impedance state.
  • Low Power Dissipation: The device features reduced power consumption, with ICC reduced by 50% compared to previous generations, making it an eco-friendly choice for power-sensitive designs.

Package and Quality

The 74LVCH16823DGG is offered in a TSSOP48 (Thin Shrink Small Outline Package 48) package, which provides a compact footprint and is suitable for space-constrained applications. The package is also designed for improved thermal performance and reliability. This product is compliant with JEDEC standard no. 8-1A and is available in a lead-free version, signifying NXP's commitment to environmental sustainability.

Applications

With its advanced features, the 74LVCH16823DGG is ideal for a variety of applications, including:

  • Server and workstation memory interfaces
  • Communication infrastructure
  • High-speed data paths
  • Signal buffering and distribution
  • Industrial control systems

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