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LBEE1W8KGC-267

Part No LBEE1W8KGC-267
Manufacturer Murata Electronics North America
Catalog OEM Parts (J - L)
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

RoHS Non-Compliant
Win Source Part Number 1017168-LBEE1W8KGC-267
Categories OEM Parts(J-L)
Manufacturer Murata Electronics North America
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian LBEE1W8KGC-267 CAD Model

Description

The LBEE1W8KGC-267 is a compact and high-performance Wi-Fi and Bluetooth combo module manufactured by Murata Electronics North America. This module is designed for embedded applications requiring wireless connectivity, such as IoT devices, wearable electronics, and industrial equipment. It supports IEEE 802.11 a/b/g/n/ac Wi-Fi standards and Bluetooth 5.2, providing versatile wireless communication capabilities.

Applications:

  • Internet of Things (IoT) devices
  • Wearable electronics (smartwatches, fitness trackers)
  • Home automation systems
  • Industrial control systems
  • Medical devices
  • Automotive infotainment systems

Features:

  • Wi-Fi 802.11 a/b/g/n/ac dual-band (2.4 GHz and 5 GHz)
  • Bluetooth 5.2 Dual Mode (BR/EDR and Bluetooth Low Energy)
  • Compact size: Typically around 10mm x 10mm
  • Integrated crystal oscillators
  • Multiple antenna options (external antenna connector)
  • SDIO and UART host interfaces
  • Low power consumption
  • RoHS compliant

Benefits:

  • Dual-band Wi-Fi: Supports both 2.4 GHz and 5 GHz Wi-Fi bands for reliable and high-speed wireless connectivity.
  • Bluetooth 5.2: Enables enhanced Bluetooth performance with improved range and data throughput.
  • Compact size: Ideal for space-constrained applications.
  • Easy integration: Standard host interfaces simplify integration into various embedded systems.
  • Low power consumption: Extends battery life in portable devices.
  • Certified module: Simplifies regulatory compliance for wireless products.

Additional Details:

The LBEE1W8KGC-267 module supports various security protocols, including WPA/WPA2 and WEP. It also features advanced power management capabilities to minimize power consumption in different operating modes. The module is typically surface-mounted onto a PCB. The operating temperature range is -30°C to +85°C, making it suitable for a wide range of environmental conditions. Comprehensive documentation and software drivers are available to facilitate integration. Antenna diversity is supported to improve signal quality in challenging RF environments.

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