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MT47H32M16HW-25IT:G

Part No MT47H32M16HW-25IT:G
Manufacturer Micron Technology Inc.
Catalog DDR
Description DDR2 32Mx16
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Series *
Win Source Part Number 942262-MT47H32M16HW-25IT:G
Ultra Librarian 3D Model Ultra Librarian MT47H32M16HW-25IT:G CAD Model

Description

The MT47H32M16HW-25IT:G is a DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) chip manufactured by Micron Technology. It is designed for high-performance applications requiring fast memory access and efficient data transfer.

Applications

  • Desktop and Laptop Computers
  • Graphics Cards
  • Gaming Consoles
  • Networking Equipment
  • Embedded Systems

Features

  • Density: 512Mb (32M x 16)
  • Organization: 32 Meg x 16 bits
  • Interface: DDR2 SDRAM
  • Speed Grade: -25IT (indicates the clock speed and timings)
  • Package: FBGA (Fine-Pitch Ball Grid Array)
  • Operating Voltage: Typically 1.8V
  • Clock Frequency: Defined by the speed grade (-25IT). Consult the datasheet for the exact frequency.
  • Burst Length: Supports burst lengths of 4 and 8
  • Double Data Rate: Transfers data on both the rising and falling edges of the clock signal.
  • On-Die Termination (ODT): Improves signal integrity and reduces reflections.
  • Lead-Free: Compliant with RoHS standards.

Benefits

  • High Bandwidth: DDR2 technology offers significantly higher bandwidth compared to DDR SDRAM, improving overall system performance.
  • Faster System Performance: Enables faster application loading and smoother multitasking.
  • Reduced Power Consumption: 1.8V operation reduces power consumption and heat generation.
  • Improved Signal Integrity: ODT improves signal integrity and reduces signal noise for more reliable operation.
  • RoHS Compliant: Environmentally friendly due to lead-free construction.

Additional Details

The MT47H32M16HW-25IT:G's speed grade (-25IT) is crucial for determining the precise clock frequency and timing specifications. The manufacturer's datasheet is the authoritative source for this information. The memory controller must be configured with the correct timing parameters, such as CAS Latency (CL), tRCD, tRP, and tRAS, to ensure optimal performance. The FBGA package provides a compact footprint and efficient heat dissipation. Auto-refresh and self-refresh modes are supported for power management. The DDR2 SDRAM provides a significant performance upgrade over older memory technologies and is suitable for applications that demand high-speed memory access.

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