The MT47H128M8SH-25E:H is a high-performance Double Data Rate 2 (DDR2) SDRAM component manufactured by Micron Technology Inc. DDR2 SDRAM is a type of synchronous dynamic random-access memory with a high bandwidth interface. It’s widely used in computing devices requiring fast data transfer rates, such as desktop computers, laptops, and graphics cards. This particular chip has a density of 128Mb organized as 8 Meg x 8 I/O x 4 banks.
Applications:
- Desktop PCs: Used as main system memory for program execution and data storage.
- Laptops: Provides essential memory for operating systems and applications.
- Graphics Cards: Employed as video memory to store textures and frame buffer data.
- Gaming Consoles: Functions as the main memory for game execution and rendering.
- Embedded Systems: Integrated into devices requiring high-speed data processing.
Features:
- Density: 128Mb (16Mx8)
- Organization: 16 Meg x 8 I/O x 4 banks
- Data Rate: DDR2-400 (200 MHz clock)
- Interface: High-speed DDR2 interface for fast data transfer.
- Power Efficiency: Designed for low power consumption to extend battery life in portable devices.
- Package: FBGA (Fine-pitch Ball Grid Array) for compact size and improved thermal performance.
Benefits:
- High Bandwidth: DDR2 technology provides significantly higher bandwidth compared to DDR, resulting in faster data access and improved system performance.
- Improved Performance: Enables faster application loading, smoother multitasking, and enhanced gaming experiences.
- Low Power Consumption: DDR2 SDRAM is designed to minimize power consumption, making it ideal for battery-powered devices.
- Increased System Responsiveness: Faster data access speeds lead to quicker system response times and improved overall user experience.
- Compatibility: DDR2 is a well-established standard, ensuring compatibility with a wide range of systems and devices.
Additional Details:
The MT47H128M8SH-25E:H operates at a clock frequency of 200 MHz, resulting in a data transfer rate of DDR2-400. It supports various DDR2 features such as on-die termination (ODT) and differential clock inputs. The component is packaged in a FBGA, which offers excellent thermal characteristics and a compact footprint. It's built using advanced process technology to ensure high reliability and performance.