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MT29F768G08EECBBJ4-37:B

Part No MT29F768G08EECBBJ4-37:B
Manufacturer Micron Technology Inc.
Catalog IT infrastructure Memory
Description 96GB(768Gb) bit NAND Flash TLC
Sample
Rohs State rohs
ECAD Module
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Category IT infrastructure Memory
Manufacturer Micron Technology Inc.
Win Source Part Number 1452093-MT29F768G08EECBBJ4-37:B
Package Tray
Product Status Obsolete
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 768Gbit
Memory Organization 96G x 8
Memory Interface Parallel
Clock Frequency 267MHz
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature 0°C ~ 70°C (TA)
Grade -
Mounting Type Surface Mount
Package / Case 132-VBGA
Supplier Device Package 132-VBGA (12x18)
Ultra Librarian 3D Model Ultra Librarian MT29F768G08EECBBJ4-37:B CAD Model

Description

The MT29F768G08EECBBJ4-37:B by Micron represents a pinnacle in NAND Flash technology, boasting a colossal storage capacity of 96 GB (which translates to 768 Gb). This triple-level cell (TLC) NAND Flash memory chip is designed for high-capacity storage solutions that require compact form factors and energy efficiency. Ideal for use in smartphones, tablets, solid-state drives (SSDs), and other portable devices, it offers a perfect blend of density, performance, and reliability. The 'EE' designation indicates an advanced level of endurance, making it suitable for applications with high write cycles. Micron’s cutting-edge manufacturing techniques ensure optimal reliability and performance for applications demanding substantial storage space. This product's significant capacity and the ability to maintain fast data transfer rates, while conserving power, make it an indispensable component in modern electronic devices, data centers, and high-performance computing platforms.

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