Microchip Technology MCP9701A-E/TO Linear Active Thermistor™ IC
The MCP9701A-E/TO is a high-precision, low-power, linear active thermistor IC developed by Microchip Technology. It offers a cost-effective solution for temperature sensing applications with a linear temperature coefficient. The MCP9701A-E/TO comes in a small, three-pin TO-92 package, making it suitable for space-constrained applications.
This versatile sensor does not require any external calibration to provide typical accuracy of ±2°C at +25°C and ±4°C across the entire operating temperature range of -40°C to +125°C. It is capable of detecting a minimum temperature of -40°C and a maximum temperature of +150°C, offering a wide operating range for a variety of environments.
The MCP9701A-E/TO operates at a low current of 6 µA (typical), which is advantageous for portable applications where power efficiency is crucial. Additionally, the low power consumption helps minimize self-heating, an important factor for accurate temperature measurements. Its linear temperature slope is 19.53 mV/°C, and it provides an analog output that can be easily interfaced with the analog-to-digital converters (ADCs) of microcontrollers.
With its simple three-pin configuration, the MCP9701A-E/TO can be easily integrated into a wide range of applications such as industrial control systems, consumer electronics, environmental monitoring, and HVAC systems. Its robust design ensures reliable operation even in harsh conditions, making it a preferred choice for designers looking for a straightforward and efficient temperature sensing solution.
Key features of the MCP9701A-E/TO include:
- Linear temperature coefficient of 19.53 mV/°C
- Accuracy of ±2°C at +25°C
- Wide operating temperature range (-40°C to +125°C)
- Low operating current (6 µA, typical)
- Supply voltage range of 2.3V to 5.5V
- TO-92 package suitable for through-hole mounting
The MCP9701A-E/TO is a reliable and precise temperature sensor that offers ease of use for engineers and designers, ensuring accurate temperature measurement in a compact form factor.