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M2GL060-FGG676

Part No M2GL060-FGG676
Manufacturer Microchip Technology
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 387 I/O 676FBGA / IGLOO2 Field Programmable Gate Array (FPGA) IC 387 1869824 56520 676-BGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs) - Embedded - FPGAs (Field Programmable Gate Array)
Mfr Microchip Technology
Series IGLOO2
Package Tray
Product Status Active
Number of Logic Elements/Cells 56520
Total RAM Bits 1869824
Number of I/O 387
Voltage - Supply 1.14V ~ 2.625V
Mounting Type Surface Mount
Temperature Range - Operating 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number M2GL060
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2
HTSUS 8542.39.0001
Win Source Part Number 1354533-M2GL060-FGG676
Ultra Librarian 3D Model Ultra Librarian M2GL060-FGG676 CAD Model

Description

The M2GL060-FGG676 is a cutting-edge FPGA (Field Programmable Gate Array) device produced by Microchip Technology, a leader in the semiconductor industry. This product is part of Microchip's IGLOO2 family and is designed for low power, high reliability, and advanced security applications. Its versatility makes it an ideal choice for a wide range of industries, including communications, industrial, medical, defense, and aerospace.

Key Features

  • High-Density FPGA: The M2GL060-FGG676 boasts a high logic density that provides ample resources for complex digital systems, enabling designers to integrate multiple functions into a single chip.
  • Advanced Security: With a focus on security, this FPGA includes features such as secure boot, an integrated cryptoprocessor, and advanced design security options to protect intellectual property and prevent unauthorized access.
  • High-Performance: The device is engineered for performance with a high-speed serial interface and DSP (Digital Signal Processing) blocks, making it suitable for signal processing and high-speed data transfer applications.
  • Low Power Consumption: Microchip's Flash*Freeze technology allows the M2GL060-FGG676 to operate with exceptionally low power consumption, which is crucial for battery-powered and energy-sensitive applications.
  • Package Type: The FGG676 package is a fine-pitch grid array, offering a compact footprint and good thermal performance, making it easier to integrate into space-constrained designs.

Applications

The M2GL060-FGG676 is well-suited for a variety of applications that require high security, low power, and high processing capabilities. It is commonly used in:

  • Secure Communication Systems
  • Industrial Control Systems
  • Medical Imaging Devices
  • Defense and Aerospace Electronics
  • Automotive Infotainment and ADAS (Advanced Driver-Assistance Systems)

Technical Specifications

With its 60K logic elements, 240 math blocks, and 5G transceiver blocks, the M2GL060-FGG676 provides robust hardware capabilities for sophisticated designs. The device operates over a wide temperature range and is compliant with the RoHS directive, ensuring environmental sustainability.

For more detailed technical information and to explore the full capabilities of the M2GL060-FGG676, designers and engineers are encouraged to review the comprehensive datasheets and product documentation available on the Microchip Technology website.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $182.8572 $182.8572
2+ $175.7143 $351.4286
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