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A3P600-2FGG484I

Part No A3P600-2FGG484I
Manufacturer Microchip Technology
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 235 I/O 484FBGA / ProASIC3 Field Programmable Gate Array (FPGA) IC 235 110592 484-BGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs) - Embedded - FPGAs (Field Programmable Gate Array)
Mfr Microchip Technology
Series ProASIC3
Package Tray
Total RAM Bits 110592
Number of I/O 235
Number of Gates 600000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 484-BGA
Supplier Device Package 484-FPBGA (23x23)
Base Product Number A3P600
Standard Package 60
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Win Source Part Number 1348765-A3P600-2FGG484I
Ultra Librarian 3D Model Ultra Librarian A3P600-2FGG484I CAD Model

Description

Product Overview: A3P600-2FGG484I

The A3P600-2FGG484I is a high-performance FPGA (Field Programmable Gate Array) from Microchip Technology's ProASIC3 series, designed to meet the needs of a wide range of embedded system applications. This device provides a flexible and cost-effective solution for designers looking to create complex logic circuits without the high costs and long lead times associated with custom ASIC development.

Key Features

  • Flash-Based Technology: As a non-volatile, flash-based FPGA, the A3P600-2FGG484I retains its configuration even after power-down, eliminating the need for external configuration memory and ensuring a quick start-up time.
  • High Density: The device boasts 600,000 system gates, providing ample space for complex designs and logic integration.
  • Low Power Consumption: With a typical core voltage of 1.5V, this FPGA is designed for low-power applications, making it ideal for power-sensitive designs.
  • High-Speed User I/O: The A3P600-2FGG484I comes equipped with 300 user I/Os, allowing for flexible interfacing with a wide range of peripherals and other digital systems.
  • Package Type: The device is available in a 484-pin Fine Pitch Grid Array (FGG) package, which is suitable for surface mount technology and provides robust physical connections.
  • Industrial Temperature Range: With an operating temperature range of -40°C to 85°C, this FPGA is designed to perform reliably in harsh environmental conditions.

Applications

The versatility of the A3P600-2FGG484I FPGA makes it an ideal choice for various applications, including but not limited to:

  • Automotive systems
  • Industrial control systems
  • Telecommunications infrastructure
  • Medical devices
  • Security systems
  • Aerospace and defense electronics

Quality and Reliability

Microchip Technology is known for its commitment to quality and reliability, and the A3P600-2FGG484I is no exception. It undergoes rigorous testing and quality control measures to ensure it meets the stringent requirements of industrial and commercial applications.

In summary, the A3P600-2FGG484I from Microchip Technology is a robust, flash-based FPGA that offers a mix of high performance, low power consumption, and a wide operating temperature range, making it a smart choice for designers looking to add flexibility and reliability to their embedded systems.

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