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A3P600-2FGG256I

Part No A3P600-2FGG256I
Manufacturer Microchip Technology
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 177 I/O 256FBGA / series Field Programmable Gate Array (FPGA) IC 177 110592 256-LBGA
Datasheet
Sample
Rohs State rohs
ECAD Module
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Category Integrated Circuits (ICs)>Embedded - FPGAs (Field Programmable Gate Array)
Mfr Microchip Technology
Series ProASIC3
Package Tray
Total RAM Bits 110592
Number of I/O 177
Number of Gates 600000
Voltage - Supply 1.425V ~ 1.575V
Mounting SMD (SMT)
Temperature Range - Operating -40°C ~ 100°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)
Base Product Number A3P600
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Standard Package 90
Win Source Part Number 1196872-A3P600-2FGG256I
Ultra Librarian 3D Model Ultra Librarian A3P600-2FGG256I CAD Model

Description

Product Overview: A3P600-2FGG256I from Microchip Technology

The A3P600-2FGG256I is a high-performance FPGA (Field-Programmable Gate Array) device from Microchip Technology's ProASIC3 series, designed to meet the needs of a wide range of embedded systems applications. This product offers a robust and flexible solution for designers looking to integrate complex logic functions into their hardware with minimal power consumption and reliable operation in industrial environments.

Key Features:

  • High Density: The A3P600-2FGG256I features 600,000 system gates that provide ample logic for complex designs, making it suitable for a variety of applications, including industrial control, automotive, consumer electronics, and telecommunications.
  • Low Power Consumption: Engineered for power-sensitive applications, this device operates with a low static power profile, ensuring efficient use of energy and reducing the overall power requirements of the system.
  • Flash-based Configuration: Unlike SRAM-based FPGAs, the ProASIC3 series uses non-volatile flash memory for configuration, which means the A3P600-2FGG256I retains its programming without the need for external configuration sources on power-up, enhancing system reliability and security.
  • High Reliability: The device is characterized for industrial temperature ranges (-40°C to +85°C), making it an ideal choice for applications that must operate in harsh environments.
  • Speed Grade: The '-2' speed grade of the A3P600-2FGG256I ensures fast performance, suitable for applications requiring quick data processing and high-speed interfaces.
  • Package Type: Housed in a 256-pin Fine Pitch Grid Array (FGG256) package, this product offers a compact footprint while still providing a high number of I/O options for interfacing with other components in a system.

Applications:

The versatility of the A3P600-2FGG256I FPGA makes it an excellent choice for a broad range of applications. It is particularly well-suited for use in embedded systems where space is at a premium and power efficiency is a must. Its flash-based configuration and high reliability make it a go-to solution for mission-critical industrial applications, automotive systems requiring robust performance, and consumer electronics that demand both complexity and cost-effectiveness.

With Microchip Technology's reputation for quality and support, the A3P600-2FGG256I stands out as a reliable and flexible FPGA solution for designers and engineers looking to push the boundaries of what's possible in their embedded systems.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $68.6441 $68.6441
3+ $56.3233 $168.9699
4+ $54.5633 $218.2532
5+ $52.8031 $264.0155
6+ $51.0431 $306.2586
8+ $45.7627 $366.1016
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 1,000 pieces
Order Increment : 1 pcs
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