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LFXP2-17E-6FTN256C

Part No LFXP2-17E-6FTN256C
Manufacturer Lattice Semiconductor Corporation
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 201 I/O 256FTBGA / XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded>FPGAs (Field Programmable Gate Array)
Manufacturer Lattice Semiconductor Corporation
Packaging Tray
Number of LABs/CLBs 2125
Number of Logic Elements/Cells 17000
Total RAM Bits 282624
Number of I/O 201
Voltage - Supply 1.14V ~ 1.26V
Mounting Surface Mount
Temperature Range - Operating 0°C ~ 85°C (TJ)
Case / Package 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Base Product Number LFXP2-17
RoHS Status ROHS3 Compliant
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Other Part Number LFXP217E6FTN256C,220-1118
Standard Package 90
Win Source Part Number 1323222-LFXP2-17E-6FTN256C
Ultra Librarian 3D Model Ultra Librarian LFXP2-17E-6FTN256C CAD Model

Description

The LFXP2-17E-6FTN256C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, belonging to the LatticeXP2 family. This FPGA is designed for a wide range of applications requiring flexible and high-performance logic solutions.

Applications:

  • Industrial Automation: Used in programmable logic controllers (PLCs), motor control, and machine vision systems.
  • Communication Systems: Employed in networking equipment, wireless communication devices, and signal processing applications.
  • Consumer Electronics: Found in digital cameras, video processing systems, and display controllers.
  • Medical Devices: Suitable for medical imaging equipment and diagnostic tools.

Features:

  • 17,000 Logic Cells: Provides a significant amount of programmable logic for implementing complex digital circuits.
  • Embedded Block RAM: Offers on-chip memory resources for data storage and processing.
  • High-Performance I/O: Supports a wide range of I/O standards, including LVCMOS, LVTTL, and differential signaling.
  • sysIO Buffers: Provides flexible I/O configuration and impedance control.
  • Advanced Security Features: Includes bitstream encryption to protect designs from unauthorized access.
  • On-Chip Oscillator: Simplifies system design by providing a built-in clock source.
  • IEEE 1149.1 (JTAG) Boundary Scan: Supports standard JTAG testing for manufacturing and debugging.
  • Advanced Packaging: Available in a 256-pin FTN (Fine-Pitch Ball Grid Array) package.

Benefits:

  • Flexibility: Allows for easy customization and reconfiguration of digital circuits.
  • High Performance: Provides high-speed operation for demanding applications.
  • Low Power Consumption: Optimized for low power operation.
  • Security: Protects designs from reverse engineering and unauthorized copying.
  • Fast Time-to-Market: Reduces development time by allowing for rapid prototyping and design iterations.

Additional Details:

The LFXP2-17E-6FTN256C operates at a core voltage of 1.2V. It supports a wide range of operating temperatures. The device is supported by Lattice's development tools, including the Diamond design software. The FPGA is designed for applications requiring a balance of performance, power consumption, and cost. It is also suitable for applications requiring high levels of security. The FTN256 package offers a small footprint and excellent thermal performance. Detailed datasheets and application notes are available from Lattice Semiconductor.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $144.4445 $144.4445
2+ $139.6297 $279.2594
3+ $125.1852 $375.5556
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Availability: 90 pieces
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