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Same model may have multiple batches, images only for reference.
EP3C25E144A7N Real Image
Same model may have multiple batches, images only for reference.

EP3C25E144A7N

Part No EP3C25E144A7N
Manufacturer Intel
Catalog Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 82 I/O 144EQFP
Datasheet
EP3C25E144A7N Datasheet
Sample
Rohs State rohs
ECAD Module
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Products specifications Report Issue?

Categories Integrated Circuits (ICs)
Estimated Pruduction Lead Time 45 Weeks
Features series Field Programmable Gate Array (FPGA) IC 82 608256 24624 144-LQFP Exposed Pad
Manufacturer Intel
Series Cyclone® III
Package Tray
Number of I/O 82
Operating Temperature Range -40°C ~ 125°C (TJ)
Mounting Surface Mount
Package 144-LQFP Exposed Pad
Case / Package 144-EQFP (20x20)
Family Name EP3C25
MSL Level 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001
Quantity per package 60
Popularity Medium
Supply and Demand Status Limited
Win Source Part Number 870545-EP3C25E144A7N
Ultra Librarian 3D Model Ultra Librarian EP3C25E144A7N CAD Model

Description

The Intel EP3C25E144A7N is a series field-programmable gate array (FPGA) IC suitable for various applications.

  • Series: Cyclone® III
  • Temperature Range: -40°C to 125°C (TJ)
  • I/O: 82
  • Package: 144-LQFP exposed pad
  • Estimated Production Lead Time: 45 weeks
  • Suitable for: Integrated circuits (ICs) applications

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