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SAC7009LN-TP

Part No SAC7009LN-TP
Manufacturer Hynix Semiconductor
Catalog OEM Parts ( S )
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1005594-SAC7009LN-TP
Categories OEM Parts( S )
Manufacturer Hynix Semiconductor
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian SAC7009LN-TP CAD Model

Description

The SAC7009LN-TP is a Flash Memory component manufactured by Hynix Semiconductor. This NAND Flash memory device is designed for use in a wide range of applications requiring non-volatile storage. It offers high storage density, fast read/write speeds, and reliable data retention, making it suitable for embedded systems, consumer electronics, and industrial applications.

Applications:

  • Embedded Systems
  • Solid State Drives (SSDs)
  • USB Flash Drives
  • Memory Cards (SD, microSD)
  • Mobile Devices (Smartphones, Tablets)

Features:

  • High-Density NAND Flash Memory: Offers significant storage capacity in a compact form factor.
  • Fast Read/Write Speeds: Enables quick data access and storage.
  • Low Power Consumption: Optimizes energy efficiency for extended battery life in portable devices.
  • High Reliability: Ensures data integrity and long-term data retention.
  • Compact Package: Facilitates integration into space-constrained applications.

Benefits:

  • Enhanced System Performance: Improves application responsiveness and boot times.
  • Increased Storage Capacity: Allows for storing larger amounts of data and applications.
  • Extended Battery Life: Reduces power consumption, prolonging the operational life of battery-powered devices.
  • Improved Data Security: Provides reliable data storage and protection against data loss.
  • Reduced System Size: Enables smaller and more compact product designs.

Additional Details:

The SAC7009LN-TP utilizes a NAND Flash memory architecture, which provides a cost-effective solution for high-density storage. It features advanced error correction algorithms to ensure data integrity and reliability. The device is designed to operate over a wide temperature range, making it suitable for use in harsh environments. It is available in a compact package, making it easy to integrate into a variety of applications.

Specific details such as memory capacity, voltage requirements, and operating temperatures can be found in the device datasheet available from Hynix Semiconductor. The part is commonly used where a large storage capacity is needed and where small form factor and low power are important design considerations.

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