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HY5116400CT-60

Part No HY5116400CT-60
Manufacturer Hynix Semiconductor
Catalog OEM Parts (F - I)
Description Fast Page DRAM, 4MX4, 60ns, CMOS, PDSO24
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Mounting SMD (SMT)
Case / Package TSOP
RoHS Non-Compliant
Win Source Part Number 1063797-HY5116400CT-60
Categories OEM Parts(F-I)
Manufacturer Hynix Semiconductor
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian HY5116400CT-60 CAD Model

Description

The HY5116400CT-60 is a high-speed 16Mb Dynamic Random Access Memory (DRAM) chip manufactured by Hynix Semiconductor. It is organized as 4M x 4 bits and designed for applications requiring fast access times and moderate memory density. This DRAM is suitable for use in graphics cards, embedded systems, and other high-performance applications.

Applications

  • Graphics cards for frame buffer memory.
  • Embedded systems requiring high-speed memory.
  • Printers for temporary data storage.
  • Networking equipment for packet buffering.
  • Video processing systems.

Features

  • Organization: 4M x 4 bits
  • Access Time: 60 ns
  • Supply Voltage: 5V
  • Package: SOJ or TSOP
  • Operating Temperature: 0°C to +70°C
  • Fast Page Mode: Improves read/write performance.
  • TTL Compatible Inputs and Outputs: Simplifies interfacing with other logic devices.

Benefits

  • Fast access times enable quick data retrieval and manipulation.
  • High bandwidth supports demanding applications.
  • Low power consumption reduces system power requirements.
  • Compact package saves board space.
  • TTL compatibility simplifies system integration.

Additional Details

The HY5116400CT-60 utilizes advanced DRAM technology to achieve high speed and low power consumption. It supports fast page mode operation, which significantly improves read/write performance for sequential data access. The device is available in industry-standard packages, such as SOJ and TSOP, for easy integration into various systems.

The 60ns access time makes it well-suited for applications where fast memory access is critical. The device is designed to operate reliably over a temperature range of 0°C to +70°C. This DRAM provides a balance of speed, density and is ideal for various memory applications.

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