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HMT451R7BFR8A-PB

Part No HMT451R7BFR8A-PB
Manufacturer Hynix Semiconductor
Catalog Memory - Modules
Description DDR3-1600 512Mx72 ECC Reg/RDIMM 1Rx8 (4GB) 1.35V
Sample
Rohs State rohs
ECAD Module
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Categories Memory - Modules
Win Source Part Number 948461-HMT451R7BFR8A-PB
Series *
Ultra Librarian 3D Model Ultra Librarian HMT451R7BFR8A-PB CAD Model

Description

The HMT451R7BFR8A-PB is a DDR3 registered ECC memory module manufactured by Hynix Semiconductor. This module is engineered for servers and high-performance workstations demanding exceptional reliability and data integrity. The registered design incorporates a register between the DRAM modules and the system's memory controller, which reduces the load on the memory controller, enabling greater memory capacity and improved signal integrity, particularly in systems with multiple modules.

Applications:

  • Servers
  • High-Performance Workstations
  • Data Centers
  • Cloud Computing Environments

Features:

  • DDR3 Technology
  • Registered ECC DIMM (RDIMM)
  • Module Size: 4GB (1 x 4GB)
  • Module Rank: 1Rx4
  • Speed: PC3-10600 (DDR3-1333)
  • CAS Latency: CL9
  • Voltage: 1.5V
  • 240-Pin DIMM

Benefits:

  • Enhanced System Stability: Registered design improves signal integrity and reduces the electrical load on the memory controller, leading to a more stable and reliable system.
  • Improved Data Integrity: ECC (Error-Correcting Code) detects and corrects single-bit memory errors, preventing data corruption and ensuring data accuracy, which is essential for critical applications.
  • Increased Performance: DDR3 technology enables faster data transfer rates, resulting in improved application performance and overall system responsiveness.

Additional Details:

The HMT451R7BFR8A-PB module complies with JEDEC industry standards. The 'PB' likely indicates a specific manufacturing batch or revision. Consult the system or motherboard documentation to guarantee compatibility and optimal performance. The use of ECC memory is critical in applications where data integrity is paramount, such as financial transactions, scientific simulations, and medical imaging. The module is constructed with high-quality components to ensure long-term reliability and performance in demanding environments.

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