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H9CCNNN8GTMLAR-NUM_test3

Part No H9CCNNN8GTMLAR-NUM_test3
Manufacturer Hynix Semiconductor
Catalog DDR
Description LPDDR3-1866 8G 256Mx32 178Ball FBGA
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 943113-H9CCNNN8GTMLAR-NUM_test3
Series *
Ultra Librarian 3D Model Ultra Librarian H9CCNNN8GTMLAR-NUM_test3 CAD Model

Description

The Hynix H9CCNNN8GTMLAR-NUM_test3 is a type of DDR (Double Data Rate) memory component manufactured by Hynix Semiconductor. While specific details are difficult to obtain due to the nature of memory product revisions and proprietary information, its general characteristics can be inferred from common DDR memory features and Hynix's product portfolio.

DDR memory is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth interface. DDR memory achieves higher transfer rates by transferring data on both the rising and falling edges of the clock signal. The H9CCNNN8GTMLAR-NUM_test3 is likely used in various applications that demand high-speed data access and transfer.

Applications:

  • Smartphones and Mobile Devices: Used as main system memory for application processing, multimedia playback, and multitasking.
  • Tablets: Similar to smartphones, tablets rely on DDR memory for smooth operation and responsiveness.
  • Embedded Systems: Incorporated into embedded systems requiring high-speed data processing, such as industrial control systems and automotive electronics.
  • Networking Devices: Used in routers, switches, and other networking equipment for packet processing and data buffering.
  • Gaming Consoles: Provides fast memory access for game data, textures, and real-time rendering.

Features:

  • High Bandwidth: DDR technology enables high data transfer rates, improving system performance.
  • Low Power Consumption: Designed for efficiency, minimizing power consumption in battery-powered devices.
  • Compact Size: Optimized for integration into space-constrained devices.
  • Reliable Performance: Manufactured to Hynix's high standards for reliability and durability.
  • JEDEC Compliance: Complies with JEDEC standards for DDR memory, ensuring compatibility with a wide range of systems.

Benefits:

  • Improved System Responsiveness: Faster data access leads to quicker application loading and smoother multitasking.
  • Enhanced Multimedia Performance: Supports seamless playback of high-resolution videos and graphics.
  • Increased Energy Efficiency: Low power consumption extends battery life in portable devices.
  • Greater System Stability: Reliable memory performance contributes to overall system stability and uptime.
  • Future-Proofing: DDR technology offers a scalable memory solution for evolving performance demands.

The specific technical specifications of the H9CCNNN8GTMLAR-NUM_test3, such as capacity, speed grade, voltage, and operating temperature range, would require access to the product datasheet. Generally, Hynix DDR memory components are designed to meet or exceed industry standards for performance and reliability. They also often include advanced features like on-die termination (ODT) and dynamic temperature management to optimize performance and ensure stable operation under varying conditions. Due to lack of publicly available datasheets, certain specifications are difficult to ascertain without privileged access.

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