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H5TQ2G83DFR-H9I

Part No H5TQ2G83DFR-H9I
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1333 256Mx8 (2Gb) Ind
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941160-H5TQ2G83DFR-H9I
Series *
Ultra Librarian 3D Model Ultra Librarian H5TQ2G83DFR-H9I CAD Model

Description

The Hynix H5TQ2G83DFR-H9I is a 2Gb DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) chip. This memory component, produced by Hynix Semiconductor, offers high-speed data transfer rates and is designed for applications requiring substantial memory capacity and efficient performance. Its architecture and features are tailored to meet the demands of modern computing environments.

Applications

  • Desktop Computers
  • Laptop Computers
  • Graphics Cards
  • Gaming Consoles
  • Networking Equipment (Routers, Switches)
  • Embedded Systems

Features

  • Capacity: 2Gb (256M x 8)
  • Organization: Configured as 256M x 8 bits
  • Interface: DDR3, enabling high-speed data transfer
  • Data Rate: Up to 1600 Mbps (PC3-12800)
  • Voltage: 1.5V operating voltage, contributing to low power consumption
  • Operating Temperature: Standard commercial temperature range
  • Package: FBGA (Fine-pitch Ball Grid Array) for efficient board mounting and thermal performance

Benefits

  • Large Memory Capacity: 2Gb capacity supports more demanding applications and larger datasets.
  • High Bandwidth: DDR3 interface ensures fast data transfer, enhancing system responsiveness.
  • Low Power Consumption: 1.5V operation reduces energy usage, extending battery life in portable devices.
  • Improved System Performance: Faster memory access times lead to quicker application loading and smoother multitasking.
  • Reliable Operation: Manufactured by Hynix, ensuring high quality and dependable performance.

Additional Details

The H5TQ2G83DFR-H9I DDR3 SDRAM adheres to JEDEC standards for DDR3 memory. It incorporates power-saving modes to minimize energy consumption during idle periods. Key architectural features include write leveling, dynamic on-die termination (ODT), and auto-refresh, enhancing signal integrity and system stability. The FBGA package facilitates efficient heat dissipation, ensuring reliable operation even under heavy workloads. This memory chip is widely used in various consumer, industrial, and embedded applications where high performance, ample capacity, and power efficiency are essential. Its prevalence in numerous electronic devices underscores its versatility and reliability in addressing the demands of contemporary computing.

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