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H5TQ2G63BFR-H9C-C

Part No H5TQ2G63BFR-H9C-C
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR3-1333 128Mx16 (2Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941123-H5TQ2G63BFR-H9C-C
Series *
Ultra Librarian 3D Model Ultra Librarian H5TQ2G63BFR-H9C-C CAD Model

Description

The H5TQ2G63BFR-H9C-C is a DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) chip produced by Hynix Semiconductor. It is designed to provide high bandwidth and low power consumption, making it suitable for various applications. The 'H9C' likely denotes specific speed, timing, or temperature grade characteristics.

Applications:

  • Desktop PCs
  • Laptop computers
  • Gaming consoles
  • Networking devices (routers, switches)
  • Embedded systems

Features:

  • DDR3 Technology: Uses DDR3 architecture, enabling faster data transfer rates compared to older DDR versions.
  • 2Gb Density: Offers a memory capacity of 2 Gigabits (256MB).
  • Operating Frequency: Supports data transfer rates up to 1600 MT/s (Mega Transfers per second) depending on the system configuration.
  • Low Voltage: Operates at 1.5V, reducing power consumption and heat generation.
  • FBGA Package: Packaged in a Fine-pitch Ball Grid Array (FBGA) for efficient surface mounting and thermal dissipation.
  • RoHS Compliance: Compliant with RoHS (Restriction of Hazardous Substances) environmental regulations.

Benefits:

  • Increased Bandwidth: Provides high bandwidth for demanding applications, improving system responsiveness and performance.
  • Reduced Power Consumption: Low voltage operation minimizes power consumption, extending battery life in portable devices and reducing energy costs.
  • Enhanced Performance: Improves overall system performance by enabling faster memory access and data transfer.
  • Reliable Operation: Manufactured by Hynix, a leading memory manufacturer, ensuring high reliability and quality.
  • Cost-Effective Solution: Provides a balance of performance and cost, making it suitable for a wide range of applications.

Additional Details:

The H5TQ2G63BFR-H9C-C features internal banks for concurrent memory access and improved efficiency. It includes features like auto refresh, self refresh, and power-down modes for optimized power management. Detailed specifications, including timing parameters and operating temperature ranges, can be found in the Hynix Semiconductor datasheet for this part number. This memory chip is designed to deliver stable performance and reliability in various computing environments.

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