The H5TQ1G63AFR-G7C is a DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) component manufactured by Hynix Semiconductor. It is designed for use in a wide range of applications requiring high-speed memory access and low power consumption. This particular part is a 1Gb (Gigabit) DDR3 SDRAM, organized as 64M x 16.

Applications

• Desktop and Laptop Computers
• Graphics Cards
• Gaming Consoles
• Networking Devices (Routers, Switches)
• Embedded Systems
• Industrial PCs

Features

• Capacity: 1Gb (64M x 16)
• Interface: DDR3
• Speed Grade: G7C (Determines the maximum clock frequency and data transfer rate)
• Operating Voltage: Typically 1.5V
• Data Rate: Supports data transfer rates up to DDR3-1600 (PC3-12800), depending on the specific G7C speed bin.
• Clock Frequency: Operates at a clock frequency determined by the speed grade.
• Package: FBGA (Fine-Pitch Ball Grid Array)
• Lead-Free and RoHS Compliant: Environmentally friendly design.
• Power-Saving Features: Includes features like Deep Power-Down mode to reduce power consumption when the memory is not actively being used.
• Double Data Rate Architecture: Transfers data on both the rising and falling edges of the clock signal, effectively doubling the data transfer rate.

Benefits

• High Bandwidth: DDR3 technology provides significantly higher bandwidth compared to previous generations of DDR memory.
• Low Power Consumption: 1.5V operating voltage reduces power consumption, making it suitable for mobile and energy-sensitive applications.
• Improved Performance: High data transfer rates enhance overall system performance, especially in memory-intensive tasks.
• Cost-Effective: DDR3 offers a good balance of performance and cost, making it a popular choice for various applications.
• Wide Availability: DDR3 memory is widely available and supported by a large ecosystem of chipsets and platforms.
• Reliability: Designed for high reliability and stability under various operating conditions.

Additional Details

The specific speed grade (G7C) of the H5TQ1G63AFR part number determines the maximum supported clock frequency and data transfer rate. Consult the Hynix datasheet for the exact specifications associated with the G7C speed bin. The FBGA package provides a compact footprint and efficient thermal dissipation. DDR3 SDRAM utilizes a prefetch architecture to improve data throughput. This particular chip is often used in modules with other similar chips to increase the total memory capacity of a system.