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H5TC2G63FFR-H9C

Part No H5TC2G63FFR-H9C
Manufacturer Hynix Semiconductor
Catalog DDR
Description Incorrect partno DDR3-1333 128Mx16 BGA (2Gb)
Sample
Rohs State rohs
ECAD Module
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Categories Memory
Win Source Part Number 941090-H5TC2G63FFR-H9C
Series *
Ultra Librarian 3D Model Ultra Librarian H5TC2G63FFR-H9C CAD Model

Description

The Hynix H5TC2G63FFR-H9C is a 2Gb (Gigabit) DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) component. This memory chip, manufactured by Hynix Semiconductor, is designed for applications demanding higher bandwidth and improved power efficiency compared to previous DDR generations. The 'H9C' likely indicates a specific speed grade and/or other operating parameters within the DDR3 specification.

Applications:

  • Desktop and Laptop Computers
  • Gaming Consoles
  • Networking Equipment (Routers, Switches)
  • High-Definition Televisions (HDTVs)
  • Embedded Systems with High Memory Bandwidth Requirements

Features:

  • Capacity: 2Gb (Gigabit)
  • Organization: Typically organized as 128M x 16 or 256M x 8 (Consult datasheet for precise configuration)
  • Interface: DDR3
  • Data Rate: High-speed data transfer (Specific rate determined by 'H9C' speed grade)
  • Voltage: Typically operates at 1.5V to reduce power consumption
  • Package: FBGA (Fine-Pitch Ball Grid Array) for compact size and efficient PCB mounting
  • Clock Frequency: Optimized for DDR3 operation and the specific speed grade

Benefits:

  • High Bandwidth: Enables significantly faster data transfer rates compared to DDR2, boosting system performance
  • Lower Power Consumption: Reduces energy usage compared to DDR2, improving battery life in portable devices and reducing overall system power requirements
  • Increased System Performance: Faster memory access reduces latency and improves overall system responsiveness
  • Compact Size: FBGA packaging saves valuable board space
  • Reliable Operation: Designed for stable and reliable performance in a variety of operating conditions

Additional Details:

The H5TC2G63FFR-H9C conforms to JEDEC standards for DDR3 SDRAM. The 'H9C' marking indicates the specific speed bin and timing characteristics of the device. DDR3 memory achieves higher data transfer rates by utilizing an 8-bit prefetch buffer and operating at higher clock frequencies. The FBGA package provides excellent thermal performance and simplifies PCB assembly. It is crucial to consult the official Hynix datasheet for detailed timing parameters, voltage specifications, and other technical information relevant to this specific part number.

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