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H5PS1G83JFR-S6-C

Part No H5PS1G83JFR-S6-C
Manufacturer Hynix Semiconductor
Catalog DDR
Description DDR2-800 128Mx8 (1Gb)
Sample
Rohs State rohs
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Categories Memory
Win Source Part Number 942451-H5PS1G83JFR-S6-C
Series *
Ultra Librarian 3D Model Ultra Librarian H5PS1G83JFR-S6-C CAD Model

Description

The Hynix H5PS1G83JFR-S6-C is a 1Gb DDR SDRAM (Double Data Rate Synchronous Dynamic Random-Access Memory) manufactured by Hynix Semiconductor. This component is designed for applications that require high-speed memory access and efficient data handling. The 'S6-C' likely signifies a specific speed grade and operating conditions within the DDR specification.

Applications:

  • Graphics cards for entry to mid-level systems
  • Gaming consoles
  • Networking equipment
  • Set-top boxes and digital media players
  • Embedded systems with high memory demands

Features:

  • Capacity: 1Gb (Gigabit)
  • Organization: Likely 128M x 8 or 64M x 16 (consult datasheet for precise details)
  • Interface: DDR
  • Data Rate: High-speed data transfer (specific rate determined by 'S6' speed grade)
  • Voltage: Typically operates at 1.8V or lower for reduced power consumption
  • Package: FBGA (Fine-Pitch Ball Grid Array) for compact size and efficient PCB mounting
  • Clock Frequency: Optimized for DDR operation and the specific speed grade

Benefits:

  • High Bandwidth: Supports rapid data transfer, improving system responsiveness
  • Low Power Consumption: Minimizes energy usage, suitable for portable and energy-efficient devices
  • Compact Footprint: FBGA package saves valuable PCB space
  • Enhanced System Performance: Faster memory access reduces latency and enhances overall system speed
  • Reliable Performance: Designed for stable and reliable operation under various conditions

Additional Details:

The H5PS1G83JFR-S6-C adheres to JEDEC standards for DDR SDRAM. The 'S6-C' marking indicates the specific speed grade and timing characteristics. DDR memory achieves double the data transfer rate by transferring data on both the rising and falling edges of the clock signal. The FBGA package provides excellent thermal performance and simplifies board assembly. This part is commonly used in applications requiring a balance of performance, power efficiency, and cost-effectiveness. Refer to the official Hynix datasheet for detailed timing parameters, voltage specifications, and other technical information.

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